国家/地区 中国（15） 韩国（3） 台湾（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 日本（2）
IPC部 C（18）
IPC大类 C08（18）
IPC小类 C08L（18）
IPC C08L063/00（18）
发明人 LI M（2） WANG B（2）
公开年 2022（12） 2021（5）
申请年 2021（18）
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Preparing pre-constructed three-dimensional graphene network and thermal conductive composite material comprises mixing graphene and pore-forming materials, uniformly dispersing, and compressing with specific pressure, and curing the prepreg.

ZHU J, CHEN Y, ZHANG L, JIA W, LI X

Preparing thermally conductive adhesive used in power components involves mixing the matrix resin with the sheet-like thermally conductive filler, acoustic cavitation treatment and negative pressure treatment are carried out to obtain a rubber compound.

WANG B, LIU F, PAN H, XU W

High temperature resistant resin useful for double-layer oil storage tank comprises basic resin, modified high temperature resistant resin, filler, silane coupling agent, curing agent and auxiliary agent.

CHEN S, QI M, JI X

Preparing light-emitting diode packaging material for emitting white light under excitation of deep ultraviolet light, involves uniformly mixing blue and yellow nitrogen-doped graphene/carbon quantum dots in epoxy resin solution.

LIN J, WANG L, WU X, DU H, CAI X, WEI X, FAN J, YIN X, ZHANG C, LIN T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Wave absorbing glue film comprises wave absorbing layer one or two sides set with reinforcing layer outer side set with adhesive film layer outer side set with backing and absorbing layer film formed by mixing wave absorbing material and resin matrix.

ZHAO H, DU P, LI Y, LV T, LI M

Incorporation of carbon nanomaterials into polymeric matrix of composite that is adhered to metallic surfaces for protection against corrosion, involves producing reduced graphene oxide followed by sieving and incorporating into matrix.

DA SILVA MEDEIROS F, GOMIDE DE CASTRO V, GOULART SILVA G, SALOMAO RIBEIRO CURY C, MEDEIROS F D S, CASTRO V G D, SILVA G G, CURY C S R, DA SILVA M F, GOMIDE D C V, GOULART S G, SALOMAO R C C