国家/地区 中国（31）
IPC部 C（31）
IPC大类 C08（31） C09（31）
IPC小类 C08L（31）
IPC C09K005/14（31）
发明人 AN D（4） GUO H（4） XIA J（4）
CHEN Y（3） CHEN Z（2） CUI S（2）
DING P（2） GAO Y（2） LAI C（2）
LI W（2） LI Y（2） LIN Y（2）
LIU Y（2） LIU Z（2） RUAN L（2）
公开年 2017（24） 2016（5） 2018（2）
申请年 2016（31）
专利权人 TONGLING TON.（3） SHENZHEN INS.（2） UNIV GUANGDO.（2） UNIV SHANGHA.（2）

Graphene composite rubber material contains nitrile rubber, silicone resin, acrylic resin, sepiolite powder, dicumyl peroxide, barium stearate, diisononyl phthalate, oleyl alcohol polyethenoxy ether phosphate, graphene and dispersant.

INVENTOR U

Preparing graphene/polybutylene succinate composite film involves lyophilizing polybutylene succinate and rapidly pulverizin, uniformly dispersing graphene in solvent to form mixed solution, pulverizing polybutylene succinate.

HUANG J, CUI C, YAN G

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Thermal conductive composite material for electronic equipment, contains silica gel, ethylene/butylene terephthalate copolymer, graphene, aluminum powder, polyethylene glycol, titanium dioxide, amylopectin, and antioxidant.

Modified graphene-containing thermally conductive masterbatch comprises graphene, modifier and nylon 6.

CUI S, DING P, LI D, LIU J, PAN G, SHI L, SONG N, ZHANG Y

Carbon fiber-graphene filled with high thermal conductivity flame retardant plastic material useful in light emitting diode, comprises e.g. magnesium oxide, boron nitride, polybutylene terephthalate, graphite oxide and carbon fibers.

CHEN M, GUO H, AN D, XIA J, RUAN L

High thermal conductivity composite material comprises e.g. silicon carbide, aluminum powder, silicon dioxide, aluminum nitride, polyvinyl butyral, stearic acid, silver particles, dimethyl silicone oil, graphene and lithium hydroxide.

GUO H, AN D, XIA J, XIAO J, LAI C

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X

Preparing graphene-based thermally conductive interface material comprises mixing graphene material, vinyl silicone rubber, hexagonal boron nitride, vinyl silicone oil and first silane coupling agent, compressing, rolling and cutting.

DING S, ZHOU X, LIU Z

Aluminum nitride-carbon nanowire composite material for LED, contains silicon carbide, aluminum powder, silicon oxide, yttrium oxide, montmorillonite, curing agent, emulsified silicone oil, stearic acid, polyvinyl butyral and graphene.

GUO H, AN D, XIA J, XIAO J, LAI C