国家/地区 中国（23） 世界知识产权组织（5） 台湾（4） 日本（3） 欧洲专利局（EPO）（2） 韩国（2）
IPC部 C（27）
IPC大类 C08（27）
IPC小类 C08L（27）
IPC C08L063/00（27）
发明人 LI X（3） LIU R（3） ZHAO Z（3）
PAN Z（2） WANG B（2） ZHOU M（2）
公开年 2022（27）
申请年 2021（12）  2022（11）  2020（4） 
专利权人 ANHUI AEROSP.（2） LUOYANG HIGH.（2） LUOYANG JIAN.（2）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A

Processing light-weight environmental protection fiber tile comprises preparing plant fiber, glue and asphalt, transporting the plant fiber to the raw material storage bin, filling the rubber barrel with glue, artificially polishing and then impregnating with asphalt, cooling and painting.

LI X, MENG L

Graphene antibacterial agent used in metal, ceramic and plastic, comprises fixing material and hydroxyl modified graphene composite material, fixing material is aqueous polymer resin, hydroxyl modified graphene composite material comprises hydroxyl modified graphene, inorganic oxide and/or hydroxide.

LI N, WANG H, JIANG B, SONG Q

Curable resin composition used in adhesive for optical light receiving and emitting modules, sealing agent for optical light emitting/receiving module, and optical light emitting/receiving module member, comprises epoxy resin, carbon material having graphene laminated structure, and resin.

SUEMATSU M, URAYAMA T, ENAMI T, SATO K

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparing epoxy resin composite thermal conducting sheet useful in the technical field of functional sheet materials, comprises e.g. mixing the fluorinated graphene thermal conducting film, phthalic anhydride and ether, coating the mixed slurry and peeling off epoxy resin composite material layer.

PAN Z, ZHOU M

UV-curable material formulation in municipal pipeline repair, city construction, automobile, aerospace, building, day and the development of high molecular composite material and the application of each industry in each row, comprises vinyl resin, modified epoxy resin, acrylic polyurethane.

JIN W, DAI D, HUANG S, DU G

Preparing graphene composite material with thermal conductivity comprises adding aggregate and solvent to obtain mixture, mixing and stirring to obtain graphene composite slurry and injecting graphene composite slurry into mold to carry out staged heating reaction.

YANG Z