国家/地区 中国（10）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C09D（10）
IPC H05K009/00（10）
发明人 CHEN J（2）
公开年 2021（5） 2018（2）
申请年 2021（3）  2017（2）  2020（2） 
专利权人

Use of electromagnetic material modification method in preparing polyimide foam electromagnetic shielding material.

SHI J, YANG D, CHAI X, LU X, DING Z

Shielding liquid comprises one-dimensional conductive nano material (nanometre gold thread and nanometre copper wire), two-dimensional conductive nano material (single-layer graphene), first auxiliary agent (first antifoaming agent) and first solvent (ethanol and isopropanol).

MENG X, XU W

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E

Preparing electromagnetic shielding metal plate coated with polymethyl methacrylate/graphene composite film involves pre-polymerizing the dispersion, coating prepolymer solution on metal plate, drying, post-processing and cooling.

CHEN J

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X

Graphene/epoxy composite wave-absorbing material used in graphene/epoxy composite coating, comprises epoxy resin and radial graphene clusters that are dispersed in epoxy resin.

LIU L, GAO L, LI Q, LI W, GUO Y, ZHANG H

Flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages comprises sinterable, conductive metal particles, graphene, diluent, and polymer resin.

HONG X, SANCHEZ J G, CAO X, ZHUO Q

Graphene-composite functional material for preparing e.g. piezoresistive material, comprises sulfonated graphene-grafted poly-3,4-(ethylene dioxythiophene).

BAO Y, CHEN S, CHEN Z, WANG J, XU G, YANG C, XING C, ZHOU C, LOU J, ZHU T