国家/地区 中国（30） 韩国（7） 美国（5） 日本（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 台湾（2）
IPC部 C（36）
IPC大类 C09（36） C08（15） B32（5）
H01（3） B27（2） H05（2）
IPC小类 C09D（36）
IPC C09J011/04（36）
发明人 DUAN B（4） WANG Y（4） ZHANG S（3）
BAI H（2） DING H（2） DONG W（2）
LIU G（2） LIU Z（2） PARK Y S（2）
TANG Z（2） WANG J（2） WANG Q（2）
ZHANG L（2） ZHANG Y（2）
公开年 2022（13） 2021（7） 2020（4） 2015（3） 2019（3） 2023（3）
申请年 2022（10）  2021（8）  2020（6）  2019（5）  2014（2）  2015（2）  2018（2） 
专利权人 UNIV JIANGNA.（2） UNIV YANTAI（2）

Preparing long-chain polymer glue used improve thread connection performance of oil pipe, comprises adding polyacrylic acid and catechol to deionized water, adding boric acid solution, adjusting pH with sodium hydroxide solution under nitrogen protection, and mechanically stirring.

FAN H, LI S, LI H, FANG X, TUO C, LIU Z, GAO Z, ZHANG Y, NAN B, WANG J

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Heat-resistant and wear-resistant composite plate comprises high-temperature-resistant substrate, wear-resistant metal panel, heat-resistant adhesive layer and wear-resistant coating, heat-resistant adhesive layer includes heat-resistant adhesive layer compound.

ZHANG Y, RAN Y, XU J, DOU Q, ZU X

Preparing medium-density plate useful as e.g. backing board for printed circuit board drilling, comprises e.g. placing formaldehyde and methyl phenol into reactor, adding potassium hydroxide to reactant, mixing, heating, reacting, adding aminopropyltriethoxysilane, and reacting.

LI F

Heat dissipation adhesive tape with high heat dissipation performance used for electronic product e.g. mobile phone and heat source with low power and small radiator, has surface heat dissipation layer, heat conduction base material and heat conduction adhesive layer arranged from top to bottom.

HAN K

Boron nitride-doped thermally conductive enhanced agent used for curing resin in preparation of adhesive or polymer coating, is prepared by peeling and grafting boron nitride by co-grinding of melamine and boron nitride, and reacting ground mixture and formaldehyde under alkaline condition.

WANG G, YAO X, JIANG S, SHAO L

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X

Uniform heat radiating flameproof film useful in mobile phone battery, comprises: flameproof layer made of e.g. main resin A and flame retardant; soaking layer made of e.g. nano-silver slurry and aqueous polyurethane resin; and heat conducting layer made of e.g. main resin B, and curing agent.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X

Gel nail sticker comprises adhesive layer containing adhesive component and graphene having preset size, printed layer including pattern and transparent coating layer containing ultraviolet-curable resin.

KOH S W

Graphene thermal conductive ink used in composite material for thermal conductive adhesive used in thermal management, comprises graphene, aqueous polyacrylate, dispersant and solvent.

WU L, HUANG J, LIN Y