国家/地区 中国（24） 韩国（11） 台湾（6） 世界知识产权组织（6） 日本（4） 美国（3） 欧洲专利局（EPO）（2）
IPC部 C（34）
IPC大类 C09（34）
IPC小类 C09J（34）
IPC C09J011/04（34）
发明人 CHOI S（3） ICHIKAWA I（3） ISAO I（3）
KIM S K（3） LI F（3） SONG J（3）
TAKEO Y（3） YOSHINOBU T（3） YUMINSOOK（3）
GE X（2） HE X（2） HUN L S（2）
KIMTAEHAN（2） KWON H J（2） SHIM Y（2）
公开年 2022（11） 2020（7） 2021（7） 2023（7）
申请年 2021（16）  2022（7）  2019（6）  2020（3） 
专利权人 LINTEC CORP（3） PURE MANN IN.（3） SMART CITY G.（3） HANGZHOU FUX.（2）

Wave-absorbing and heat-conducting material useful in electronic component, comprises binder, tackifying resin, thickener, dispersant, agent, defoamer, wetting agent, wave-absorbing agent and heat-conducting agent.

LV G, MENG C, WANG B, YANG Y

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y

Epoxy thermally conductive structural adhesive useful in thermally conductive bonding of metal and components, polychlorinated biphenyl and thermal dissipation aluminum substrate, comprises e.g. phenolic modified epoxy resin, flake graphite, toughening agent, curing agent, dispersant, and stabilizer.

CHEN Z, CAO N, LI F

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Producing resin-based ceramic composite copper clad plate comprises e.g. adding modified hexagonal boron nitride powder into graphene oxide solution, mixing epoxy resin and carboxy-terminated nitrile rubber, coating glue on surface of aluminum plate, and laminating copper foil on glue layer surface.

SONG S

Improving electromagnetic shielding performance of magnetic suspension motor sealant, comprises adding mixed modified graphite to polymer resin pouring sealant to improve electromagnetic shielding performance of sealant.

ZHU B, LI C, PAN J