国家/地区 中国（31） 韩国（8） 台湾（4） 世界知识产权组织（4） 日本（3） 美国（2）
IPC部 C（36）
IPC大类 C09（36）
IPC小类 C09J（36）
IPC H05K007/20（26） C09J007/29（17） C09J011/04（16）
C09J007/30（8） C09J201/00（6） H05K009/00（6）
B32B007/12（5） B32B037/12（5） C09J007/20（5）
B32B009/00（4） C09J009/02（4） C09J011/08（4）
C09J163/00（4） H01L023/373（4） B32B003/24（3）
发明人 HE X（5） YANG S（5） CAO Y（4）
DOU L（4） SUN A（4） ZHOU X（4）
CHOI S（3） FANG X（3） ICHIKAWA I（3）
ISAO I（3） LIU J（3） SONG J（3）
TAKEO Y（3） YOSHINOBU T（3） YUMINSOOK（3）
公开年 2022（19） 2021（10） 2023（7）
申请年 2021（36）
专利权人 SHENZHEN HFC.（4） LINTEC CORP（3） PURE MANN IN.（3） HANGZHOU FUX.（2）
SUZHOU XUYUA.（2） YANCHENG JIU.（2）

Low-density composite electromagnetic shielding plate used in electronic product comprises electromagnetic wave-absorbing foam layer arranged between two composite shield layers, and composite shielding layer, and glass fiber-reinforced epoxy insulating layer are alternately stacked.

LI H

Manufacturing heat dissipation sheet using graphene useful for electric or electromagnetic devices comprises preparing dispersion having graphene or graphene oxide, adsorbing metal salt to graphene or graphene oxide by adding metal salt.

JIN K

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Ultra-thin graphite radiating film for use in electronic device, has release material layer adhered on surface of heat-conducting adhesive layer, where surface of material layer and adhesive layer contact is provided with convex points.

JIANG D, LIU J, ZHOU E

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Electromagnetic wave shield heat dissipation adhesive sheet useful for electrical and electronic devices e.g. semiconductor chips, and chargers comprises heat dissipation layer, electromagnetic wave shielding layer and adhesive layer.

KIMTAEHAN, HUN L S, SONG J, CHOI S, YUMINSOOK, YOUK S K, SHIM Y

Heat-conducting film for use in electronic product, has composite layer comprising graphene layer, where graphene layer is set on side of non-substrate heat conducting double-sided adhesive layer far away from artificial graphite layer.

WANG Q, ZHANG Y, ZHANG D

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z