国家/地区 中国（19）
IPC部 C（19）
IPC大类 C21（19） C22（19） B22（8）
B21（5） C23（5） H01（5）
C01（4） C30（3） B32（2）
C25（2）
IPC小类 C21D（19）
IPC C22F001/08（19）
发明人 WANG X（3） GE P（2） GUO D（2）
HE W（2） LI J（2） LI X（2）
PENG Y（2） WANG Q（2） YANG Z（2）
ZHANG W（2）
公开年 2021（14） 2022（4）
申请年 2021（13）  2020（3）  2022（3） 
专利权人 ANHUI GREEN .（2）

In-situ interface modification method of graphene copper-based composite material involves adding copper powder after annealing and reduction into mixed solution of carbon source and copper salt in oil bath heating environment, and coating carbon source with copper ion powder.

ZHANG D, LI Z, PENG Y, DONG Z, XIONG D

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Mining hydraulic support repairing device, has adjusting mechanism comprising two sliding groove plates symmetrically and uniformly distributed and fixedly installed on top surface of bottom plate.

XIE S, SHAO H, JIAO G, ZHANG H, LI X

Preparing single crystal graphite comprises e.g. placing metal foil in plasma device, introducing nitrogen-containing gas, starting plasma excitation source for plasma treatment, placing metal foil in reaction furnace, annealing, starting growth of graphene single crystal at growth temperature.

ZHAO M, LI G, WANG B, WEI W, XU X, GUO Y, LI J, JIAN X, QUE L, ZHOU Z

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Method for preparing high-strength and high-conductivity copper/graphene composite material, involves conducting electrical and thermal conductivity, tensile properties and other tests on rolled clad sheet and heat-treated clad sheet, and comparing and observing microstructures.

YI Y, WANG G, ZHANG S, YU H, ZHANG X, JIANG Q

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Ultra-low chromium content copper tungsten-copper chromium integral electrical contact comprises copper tungsten arc resistant end and copper chromium conductive end.

LIU P, YANG R, ZHOU N, ZHAO J, KANG D, ZHOU X

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparing nitrogen-doped graphene comprises taking ionic liquid as precursor, spin-coating ionic liquid on the annealed copper foil in argon/hydrogen atmosphere and preparing nitrogen-doped graphene by high-temperature thermal decomposition.

GUAN S, WANG X, LI S, PENG Y