国家/地区 中国（9）
IPC部 C（10）
IPC大类 C25（10） H01（5） C23（3）
IPC小类 C25D（10）
IPC C25D015/00（4） H01B013/00（4） C25D003/38（3）
C23C016/26（2） C25D003/12（2） C25D021/18（2）
发明人 WANG M（10）
公开年 2016（2） 2017（2） 2022（2）
申请年 2016（4）  2021（2） 
专利权人 WANG M（4） UNIV CHINA S.（2）

Electrolytic solution useful for metal nickel plating layer, comprises nickel ion, aqueous solution of borate ion and additive, where additive is used for promoting stripping of electroplating layer.

CHEN W, WANG M

Layered pore structure graphene used in cutter, is prepared by performing esterification reaction to oxidized graphite solution and intercalation agent, adjusting pH value of solution, drying to obtain esterified graphene powder, and heating.

WANG M, LI J, LI K, BIAN M, ZHANG C, LIN Q, FU H, LIU Z

Electrolytic solution used for electroplating substrate e.g. carbon carbon felt, comprises nickel ion, and aqueous solution of borate ion and additive that is used for promoting stripping of electroplating layer.

CHEN W, WANG M

Preparation of composite material involves mixing copper sulfate pentahydrate, sulfuric acid, hydrochloric acid, graphene dispersion and water to form composite electrodeposition solution, electroplating, drying, pressing, and sintering.

TAO J, WANG M, YI J, LIU Y, BAO R, LI F, LI C, YOU X, TAN S

Preparing fibrous nickel-bismuth battery involves preparing reduced graphene oxide-bismuth-carbon nanotube fiber anode, and spinnable carbon nanotube array is synthesized by chemical vapor deposition.

PENG H, WANG M, XIE S

Producing copper conductive line core involves preparing electroplating solution, where electroplating solutionv has certain concentration of copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene.

WANG M

Processing copper conductive line core involves preparing electroplating solution, where electroplating solution has certain concentration of copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene.

WANG M

Manufacture of electric wire and cable comprises preparing plating solution containing copper sulfate, sulfuric acid, chloride ion, surfactant and nano-graphene, setting copper sheet anode and copper cathode in plating solution, and heating.

WANG M

Preparing conductive wire core involves preparing plating solution by mixing copper sulfate, sulfuric acid, chloride ion, surfactant, nano-graphene and nano activated carbon and ultrasonically treating.

WANG M

Preparation of nano-graphene network involves coating silicon wafer with poly(methyl methacrylate) graphene and silica, obtaining graphene and poly(methyl methacrylate) silicon wafer, plasma etching, and treating with organic solvent.

FEI G, GAO X, HU Z, WANG M, YI H