国家/地区 美国（8）
IPC部 C（8） H（6） B（4）
IPC大类 C23（8）
IPC小类 C23C（8）
IPC C25D015/00（4） B82Y030/00（3） H01L021/02（3）
H01M004/04（3） B01J035/00（2） B01J037/02（2）
B22F001/02（2） B82Y040/00（2） C23C002/00（2）
C23C016/02（2） C23C018/12（2） C23C028/00（2）
C25D011/02（2） C25D013/02（2） H01M004/13（2）
发明人 GABEN F（2）
公开年 2021（8）
申请年 2020（8）
专利权人

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Coating electrical current collector involves treating portion of surface of electrical current collector with adhesion promoting composition to deposit treatment layer over portion of surface of electrical current collector.

HELLRING S D, FURAR E A, ORLER H L, OAKES L J

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Doping method involves stacking sacrificial layer on doped layer, arranging doping material on the sacrificial layer, arranging electrodes on doping material and doped layer, and doping doping material into doped layer.

SON K, KIM T, SON A

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M