国家/地区 中国（10） 美国（3）
IPC部 C（13）
IPC大类 C25（13） C23（5） C01（3）
G01（3） B23（2） C04（2）
C09（2）
IPC小类 C25D（13）
IPC C25D005/54（13）
发明人 CHEN Z（2） MA X（2）
公开年 2022（13）
申请年 2021（6）  2022（6） 
专利权人

Manufacture of aerospace component involves treating surface of polymeric substrate with laser to form porous graphene at surface, and bonding metallic layer to porous graphene.

POTEET S, HUAPAYA R L N, BORDAGE K R, ROJAS HUAPAYA L N, ROJAS L N R

Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.

MIAO H, ZHU K

Highly conductive graphene-pretreated electroplated metal fibers, comprises graphene oxide layer provided on outside of non-woven fabric, outside of metal nickel layer provided with electroplated copper layer, and protective nickel layer provided on outside of electroplated copper layer.

HU T, FANG R

Vertical graphene electronic medium electrode material for electrochemical biosensor item, substrate material selected as vertical graphene material, and electronic medium film uniformly loaded on three-dimensional petal structure.

DING X, ZHONG X, ZHAO X, SHI L

Multilayer electrically conductive wire for use in aeronautics field to lighten airplane, has central support core, set of pairs of layers around central support core comprising intercalary layer made of non-carbon based material and graphene layer, and first layer arranged on outer surface.

LEKARSKI K

High-temperature-resistant composite material used in selective absorption of electromagnetic waves, is composed of composite material medium layer which is fiber preform reinforced ceramic matrix composite material comprising wave-transmitting layer and loss layer, and periodic structure layer.

SHANG L, XIAO Q, CHEN Z

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Non-enzyme sensor element for detecting concentration of analyte, has catalyst layer electroplated on graphene layer, where catalyst layer comprises metal oxide and is used to oxidize analyte.

LIN Y, LIN S, CHEN Y, WANG H

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Improving warping of copper-clad ceramic substrate motherboard comprises ball-milling and drying modified hollow glass microbead with ethanol and microfiber, mixing composite hollow glass microbead with nickel sulfate, nickel chloride, boric acid, sodium citrate and water, electroplating and etching.

LIU X, YANG K, YU X