国家/地区 中国（8）
IPC部 C（8）
IPC大类 C25（8） C23（4）
IPC小类 C25D（8）
IPC C25D005/48（8）
发明人 ZHANG Q（3） CHEN Y（2） WANG X（2）
ZHANG J（2）
公开年 2022（8）
申请年 2021（5）  2022（3） 
专利权人

Preparing corrosion resistant coating electrode used for circulating external drainage and desalting comprises polishing and deionized water titanium base plate into acid solution, etching, using cathode and anode salt solution as electrolyte, coating graphene dispersion liquid, and drying.

ZHANG J, MIAO Y, YAN Z, MENG Z, FAN L, LI Y, SONG C, XIU C, ZHANG Q, WU X, XIE X, WANG X

Processing titanium-based nano composite anode for zinc electrodeposition, comprises soaking acidic-etching titanium plate in modified multi-walled carbon nanotubes suspension, reacting, preparing -lead dioxide layer titanium base electrode, cleaning and drying.

LI H, ZHAO C, FENG Z, ZHANG Q, FENG F

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Composite plating layer comprises a silver layer, a silver-graphene layer and a surfactant molecular layer comprising surfactants containing mercapto and/or silicon, imidazoline amphoteric surfactant, sodium lauroyl sarcosinate and sodium lauryl sulfate.

HUANG Y, MA G, HAO W, CHEN Y, ZHANG Q, CHEN B, ZHU Z, DING Y, GUO W, ZHANG C, PANG Z

Preparation of ultrathin beta-radiation source for micro-components, involves using polymethyl methacrylate/graphene film and platinum sheet, and depositing beta-radiation source on graphene using solution of e.g. beta-radiation source.

ZHANG J, LI C, WANG X, XU P, FENG H, CHEN Z, YANG Y, WU W, ZHOU C, LUO T

Chemical plating nickel-phosphorus-graphene composite coating comprises phosphorus, graphene, and nickel, where nickel-phosphorus-graphene composite coating is attached to surface of nickel plating layer and nickel plating layer is attached to surface of substrate.

LIU J, DAI Z, XUE H, LIU P, CHEN Y, ZHANG G, MENG X, ZHANG X, YANG C

Preparation of high temperature resistant copper wire includes calcining magnesium, chromium, titanium, nickel and copper to obtain metal mixture, casting metal mixture into ingot, forging ingot to strip copper core and spraying electroplated copper wire with high-temperature resistant coating.

QIAN G, XU H, SUN F, LAI S

Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.

ZHENG Q, LI X