国家/地区 中国（8）
IPC部 C（8）
IPC大类 C25（8） C01（2）
IPC小类 C25D（8）
IPC C25D007/06（8）
发明人 ZHANG Y（2）
公开年 2022（8）
申请年 2022（7） 
专利权人

Processing high corrosion-resistant stainless steel strip for battery shell, comprises placing stainless steel strip in alkali liquid for ultrasonic cleaning, soaking cleaned stainless steel strip in cleaning solution, heat-treating, naturally cooling, and carrying out surface smoothing treatment.

JIANG X, MAO A, JI Y, DING F, XU W, YU X, YU J, WANG Y, SHAN C, FAN G

Gold palladium plating solution useful for electroplating copper wiree, comprises water-soluble gold salt, palladium salt, graphene quantum dot, ethylenediamine, complexing, conductive salt, buffer, stabilizer and solvent.

WANG F

Electrochemical glucose sensor electrode used for e.g. clinical diagnosis and treatment of diabetes, comprises graphene composite fiber modified with gold nanosheets, where gold nanosheets are modified with nickel nanoparticles.

JIANG Z, SUN L, GAO W, ZHAO L, MAO Q, WANG C, LIN Q, ZHANG Y, JING W, HAN F, LI P

Use method of nickel plating on aluminum and aluminum alloy coils, comprises e.g. taking platinum electrode as anode, taking aluminum and aluminum alloy coils as cathode, taking conductive ink as electroplating solution, and then placing in sonicator, heating, sonicating, and electroplating.

CHEN Z

Manufacturing titanium fiber used in e.g. biomedical field, comprises subjecting titanium wire to acid washing, pre-nickel plating, and surface copper plating to obtain copper-plated titanium wire, compounding dried copper-plated titanium wire bundled iron pipe, and spraying modified alumina agent.

OUYANG Q, SHUAI G, WEI S, WU X

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y

Graphene quantum dot composite plating solution for electroplating copper sheet, comprises graphene quantum dots, nickel sulfate, nickel chloride, boric acid, organic additives and water-soluble nonionic surfactant.

CHEN N, LI Y, LI Z, LEI W

Preparation of high temperature resistant copper wire includes calcining magnesium, chromium, titanium, nickel and copper to obtain metal mixture, casting metal mixture into ingot, forging ingot to strip copper core and spraying electroplated copper wire with high-temperature resistant coating.

QIAN G, XU H, SUN F, LAI S