国家/地区 台湾（29）
IPC部 C（29）
IPC大类 C09（29）
IPC小类 H01L（29）
IPC C09K005/14（9） H01L023/373（8） H05K007/20（8）
C08K003/04（7） C09J011/04（7） C08J007/04（5）
B82Y040/00（4） C01B031/02（4） C01B031/04（4）
C08K003/08（4） C09J009/02（4） C09J163/00（4）
H01L023/36（4） B32B009/00（3） B82Y030/00（3）
发明人 HENCKENS A（3） ICHIKAWA I（3） ISAO I（3）
TAKEO Y（3） YOSHINOBU T（3） CHANG C（2）
CHEN Y（2） CHEN Z（2） ESTRUGA O M（2）
ESTRUGA ORTIGA M（2） ESTRUGAORTIGAMARQUE（2） LIN Y（2）
YU H（2）
公开年 2022（10） 2021（6） 2014（3） 2015（2） 2017（2） 2018（2）
申请年 2021（8）  2020（6）  2013（4）  2011（2）  2016（2）  2018（2） 
专利权人 HENKEL AG C.（3） LINTEC CORP（3） FUJI POLYMER.（2） WISCONSIN AL.（2）

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Resin composition used for forming adhesive film for forming dicing die-bonding film, comprises polymer substrate comprising curing agent and (meth)acrylate-based resin, and magnetic filler comprising core and coating layer containing yttrium oxide and ferrite.

JANG J M, JU L K, SUN Y, SUN Y L, LEE K J

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K