国家/地区 中国（82）
IPC部 C（82）
IPC大类 C08（82）
IPC小类 C08L（82）
IPC C08K003/04（43） C09K005/14（24） C09D007/61（21）
C08J005/18（18） C08J007/04（15） C08K003/22（15）
C08L083/04（13） C08L023/08（10） C08L067/02（9）
C08K009/04（8） C08L023/12（8） C08L063/00（8）
C08L075/04（8） C09D007/62（8） C08J009/36（7）
发明人 CHEN C（7） WANG J（7） WANG S（5）
ZHANG J（5） CHEN J（4） LI H（4）
LIU H（4） WU X（4） CHEN Y（3）
HE Y（3） LI J（3） LI W（3）
LI X（3） LIN Y（3） XU Y（3）
公开年 2023（82）
申请年 2022（63）  2023（12）  2021（7） 
专利权人 CHANGZHOU WI.（2） DONGGUAN JIA.（2） TAN KAH KEE .（2） UNIV JILIN（2）
UNIV XIAMEN（2）

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Production process of solarization-resistant wine packaging box comprises molding injection-molded plastic wine packaging box for polishing, coating ultraviolet resistance coating, drying, treating, and subjecting plastic wine packaging box for ultraviolet laser printing trademark pattern.

WANG H, MA X

Janus structure program temperature control elastic material used in solar passive heating, comprises Janus double-layer structure comprising first structural layer and second structural layer stacked on top of each other, where first structural layer has adjustable solar light transmittance.

HU X, WANG J

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Iron(II, III) oxide/iron-silicon-aluminum/graphene composite reinforced poly(lactic acid)-based three-dimensional printing wave-absorbing wire useful in various complex environments, comprises iron(II, III) oxide, iron-silicon-aluminum, graphene and poly(lactic acid).

WU H, HE E, YANG C, GAO Q, YAN T, YE X

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Laminated waterproof and antibacterial medical packaging material comprises polycarbonate, sodium polyacrylate, isomeric tristyryl polyoxypropylene ether polymer, benzenesulfonyl chloride, N, N'-dimethylmethylene acrylamide, polyvinyl chloride, cetyltrimethylammonium bromide and polyethylene glycol.

ZHU X, CHEN C

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Preparing high-concentricity capillary electrophoresis electrochemical detection disk electrode molten ball, comprises e.g.winding the electrode lead at one end of rod-shaped electrode body, dipping other end of rod-shaped electrode body into molten hot-melt adhesive, and post-processing.

LU B, CHEN C, WU Q, PENG L, WANG L, CHEN G