国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08G（7）
IPC C08K003/04（7）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2）
公开年 2015（3）
申请年 2015（2） 
专利权人 SAMSUNG ELEC.（3）

Preparing graphene-doped fluorine-containing silicon-based epoxy-based polymer encapsulating material comprises e.g. preparing fluorine-containing silicone epoxy polymer by uniformly mixing alicyclic epoxy-containing acrylic monomer.

Modified epoxy resin adhesive used in LED chip packaging comprises bisphenol A epoxy resin, m-phenylenediamine, oxidized graphene, nano zirconium oxide, carbon nanotube, silane coupling agent and aluminum isopropoxide.

QIN T

Electrically conductive paste used for solar cell and for producing electrodes used in printed circuit board, comprises bismaleimide, matrix resin, epoxy diluent, dispersing agent and modified nano silver flakes supported graphene.

CHEN G, HUANG J, LIANG W, XU X, WANG S

Sulfanilic graphene oxide doped sulfonated polyether ether ketone/epoxy resin semi-interpenetrating proton exchange membrane material comprises e.g. epoxy resins diethylenetriamine crosslinking agent as main body.

GUO Q, LIU H, LIU J, XU F, YU Z, BI C, HUANG Y

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J