国家/地区 中国（26）
IPC部 B（26）
IPC大类 C08（26） B32（15） B29（7）
D06（4） B33（3） B82（3）
B01（2） C09（2） H05（2）
IPC小类 C08K（26）
IPC C08L063/00（26）
发明人 WANG L（3） CHEN J（2） CHEN K（2）
HE H（2） HU R（2） LIN Y（2）
LIU Y（2） WANG Y（2） WEI J（2）
WU H（2） WU X（2） YU D（2）
公开年 2022（26）
申请年 2022（16）  2021（8）  2020（2） 
专利权人 HUIZHOU ZHON.（2） ITEQ WUXI EL.（2）

Casting wax useful in useful in precision casting process and in workshop environment and section processing procedure, comprises paraffin, ethylene-vinyl acetate and resin.

LU Y

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Preparing X-band stealth/lightning protection skin comprises laying up carbon fiber prepreg, conductive prepreg, wave-absorbing prepreg and wave-transmitting prepreg in sequence on surface of tooling, obtaining first skin, and molding first skin by vacuum bag process.

LI B, SONG Z, WEN Y, LIU Y

Preparing a cold/hot press molding of high-conductivity composite heat dissipation products useful in electronic device, comprises e.g. taking heat conduction material powder, aqueous resin, curing agent and processing aid, obtaining resin mixture, mixing, granulating, calendering and crushing.

LIN Y, LI K

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing environmentally friendly low-smoke, halogen-free and highly flame-retardant butyl rubber damping sheet used for damping, noise reduction and sound insulation, comprises e.g. kneading loaded graphene and polymer substrate, continuously mixing, extruding and forming.

YUAN Y, WU X, ZHANG H, ZHANG Q

In-situ wetting conversion structure used in liquid drop dynamic control platform for liquid drop transfer, microfluidic and biochemical engineering comprises shape memory micro-structure surface covered on base body, and base body of electric heating film is dimethyl silicone polymer.

SUI X, SUN Y, XUE Y, WANG Y, LIANG W

Preparing radiating micro-structure heat composite material useful in electronic device, comprises depositing high molecular aqueous solution into heat-conducting filler with filter film, freezing, cooling, drying, injecting thermosetting polymer, vacuumizing heating and curing.

HU R, FAN Y, YANG X, ZHOU S, XIE B, ZHANG X, LUO X

Electromagnetic shielding cable used in communication, sensing, measurement, control, data acquisition and high technology fields, comprises sheath layer from outside to inside, shielding layer and cable core, where sheath layer is modified graphite aerogel.

LIU L

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y