国家/地区 中国（13）
IPC部 C（13）
IPC大类 C09（13） B32（2） C08（2）
IPC小类 C09J（13）
IPC C09J183/04（13）
发明人 GAO J（3） QIAN L（2）
公开年 2017（8） 2018（5）
申请年 2017（13）
专利权人 CHENGDU FANX.（3） QIAN L（2）

Conductive film comprises release film and conductive adhesive layer e.g. polydimethylsiloxane, graphene, AS resin, butylbenzene rubber, polyvinyl formal resin, butadiene rubber, N,N-dimethylformamide, urea resin, and methylenediamine.

GAO J

Preparation of high heat-conductivity pressure-sensitive adhesive by mixing graphene powder and boron nitride powder, adding thermally conductive carbon material, mixing, and obtaining composite heat-conductive filler.

LI X, LI W, MO J

Preparation of organic silicone conducting resin by mixing e.g. dimethyl silicone polymer, graphene, styrene-acrylonitrile resin, styrene-butadiene rubber, N,N-dimethylformamide, copper and tetrahydrophthalic anhydride, and extruding.

GAO J

Preparation of electroconductive adhesive involves mixing graphene mixture comprising graphene and polyethylene glycol, with premix containing polydimethylsiloxane, acrylonitrile-styrene resin, polyvinyl formal resin and butadiene rubber.

GAO J

Preparing silane functional graphene used in antistatic silicone pressure-sensitive adhesive, involves adding concentrated sulfuric acid to three-necked flask, keeping temperature stable in an ice-water bath, adding sodium nitrate.

LI L, YUE S

Antibacterial epoxy resin adhesive includes polyurethane, allyl glycidyl ether, defoaming agent, ethyl acetate, liquid silicone rubber, (4-benzyl-1,4-oxa-2-yl) methanamine, curing agent, accelerant, graphene oxide and nano aluminum oxide.

ZHU L

Double-component doped graphene conductive organic silicon sealing glue comprises liquid vinyl polysiloxane, reinforcing agent, electrically conductive filler, catalyst, inhibitor, and diluting agent.

FAN Z, LIU M, REN H, SUN Q, ZHENG F

Preparing weather-resistant photovoltaic back plate material involves dissolving polyvinylpyrrolidone in anhydrous ethanol and binder, and subjected to ultrasonic dispersion to obtain viscous liquid, aluminum powder and graphene powder.

LIU S, YOU L, FANG Z

Thermally conductive film comprises modified acrylic oligomer, zinc oxide, butyl rubber, chloroprene rubber, thermal conductivity filler, halogen-free epoxy resin and graphene boron nitride nanoplatelet.

QIAN L

Silicone adhesive comprises useful for electronic component packaging, inorganic electrically and thermally conductive material that comprises nano-silver material, nano-alumina, boron nitride and graphene composite material.

CHEN D