国家/地区 中国（23）
IPC部 B（23）
IPC大类 B32（23）
IPC小类 B32B（23）
IPC B32B017/02（23）
发明人 WANG Q（3） CHEN K（2） LI Y（2）
WANG X（2） WU H（2） YU D（2）
ZHANG J（2）
公开年 2022（9） 2021（6） 2018（4）
申请年 2020（7）  2022（6）  2018（5）  2021（4） 
专利权人 ITEQ WUXI EL.（2） JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Backboard useful in fields of mobile phone backboard, comprises silicone layer, reinforcement layer and polycarbonate layer arranged in sequence from top to bottom, which has ultra-thin thickness, high strength and stain proof.

LIU W, GAN X, XU X, TAO Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Preparing flame-retardant and aging-resistant cover plate useful for automobile luggage box and separating spare tire luggage, comprises e.g. mixing pentaerythritol, phosphorus oxychloride and chloroform, filtering and collecting product, performing vacuum, and drying flame retardant intermediate.

LIU X

Preparing anti-deformation acrylic sheet with thermal insulation function comprises e.g. preparing acrylic base layer, preparing fiber layer, preparing thermal insulation coating, coating the thermal insulation layer coating on the fiber layer, and drying.

ZHANG X, LIN X, JIA L, WANG J, ZHU X

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S