国家/地区 中国（22）
IPC部 B（22）
IPC大类 B32（22）
IPC小类 B32B（22）
IPC B32B027/04（22）
发明人 CHAI S（2） CHEN K（2） SU X（2）
WU Y（2） YU D（2） ZHANG Y（2）
ZHOU L（2）
公开年 2014（5） 2022（5） 2021（3） 2023（3） 2018（2）
申请年 2022（5）  2013（4）  2020（4）  2021（3）  2017（2） 
专利权人 GUANGDONG SH.（2） ITEQ WUXI EL.（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Nano-filler reinforcing fiber hybrid structure ballistic resistant composite material formed by paving first prepreg (nano filler modified fiber prepreg) obtained by soaking reinforcing fiber in modified aqueous polyurethane and second prepreg (weft-free cloth) obtained by soaking reinforcing fiber.

QI C, SONG L, SHANG B, ZHAO Y, GUO M

Durable and easy-to-clean reinforced composite wooden floor comprises wear-resistant decorative layer, base material layer and balance layer from top to bottom, where wood floor is prepared by e.g. adding dimethylacetamide to reactor, stirring, and adding melamine and paraformaldehyde.

HUANG S, LEI X

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Epoxy resin composite material comprises component A and component B that are compounded with each other, where component A includes epoxy resin, preservatives, ultra-fine light calcium carbonate powder, graphene, and component B including carbon fiber mixed cloth woven from carbon fiber threads.

ZHANG W, FEI G, YUAN S

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Graphene/SiCnw composite film modified carbon fiber composite material comprises composite preform impregnated with liquid resin and cured to obtain composite material.

ZHOU L, WANG B, ZHANG Y, WANG F

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C