国家/地区 美国（11）
IPC部 H（9） C（4） B（2）
IPC大类 H01（8） H05（5） C01（3）
IPC小类 H01L（5） H05K（5） C01B（3）
H01M（3）
IPC H05K003/00（5） H05K001/02（4） H05K001/18（4）
H05K003/46（4） H01L021/48（3） H01L023/498（3）
H05K001/03（3） C01B032/182（2） H01L023/492（2）
H01L023/538（2） H01M004/36（2） H01M004/62（2）
H05K001/09（2） H05K001/11（2）
发明人 ZHENG X（11）
公开年 2021（6） 2013（2）
申请年 2020（5）  2013（2）  2021（2） 
专利权人 AT S AUSTRI.（2） AT S AUSTRI.（2） AT S CHINA .（2）

NaCl-rGO composite for a positive electrode active material of a sodium secondary battery (all claimed), such as mobile phones, camcorders, research and development efforts on electrochemical devices, comprises rGO refers to reduced graphene oxide, and sodium chloride nanoparticles are located rGO.

CHANG W Y, JUNG H, KIM E S, IQRA M, ROH H K, CHUNG K Y, ZHANG Y, ZHENG X, KIM E, ROH H, ZHENG J, NOH H K, JUNG H G, CHANG W

Method for manufacturing component carrier e.g. printed circuit board, involves creating blind hole in stack towards embedded component, and extending blind hole by etching to expose surface portion of embedded component.

TUOMINEN M, TAY S K, ZHENG X

Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack , Manufacturing component carrier comprises providing laminated stack having electrically conductive layer structure and/or electrically insulating layer structure, at least partially covering component with transition layer and assembling component with stack.

TUOMINEN M, TAY S K, LIU K, BAFTIRI A, GUO H, ZHENG X, LIU Q, GUO Z

Component carrier e.g. laminate-type component carrier, comprises stack comprising electroconductive layer structure(s) and/or electrically insulating layer structure(s), in which portion of structure comprises material.

TAY S K, TUOMINEN M, ZHENG X

Carrier for e.g. electronic components comprises stacked electrically insulating layer structures, and through hole with narrower inner portion compared to exterior portions and filled with electrically conductive filler.

TUOMINEN M, TAY S K, SUN S, ZHANG R, ZHENG X, SUN L, ZHANG Z

Semi-flexible component carrier e.g. semi-flexible printed circuit board (PCB) has electrically insulating layer structure which forms portion of semi-flexible section in which material with elongation of greater than specific value.

XIN N, TUOMINEN M, TAY S K, XIN L, ZHENG X

Cosmetic composition, quasi-drug composition or pharmaceutical composition used for providing e.g. skin regeneration, anti-wrinkle and moisturizing or antioxidant effects and preventing skin aging, comprises graphene quantum dots.

JEONG S G, HONG B H, KYUNG S Y, CHOI Y S, KIM J H, YOON S K, YEO H J, KANG S H, PARK M S, JUNG S, CHOI Y, JUHEE K, YUN S K, YEO H, PIAO M, JIANG C, LV X, YIN X, KIM J, QING R, HONG B, ZHENG X

Composition of matter for energy storage comprises a set of ligaments each independently comprising layers of graphene in which the set of ligaments is arranged according to a deterministic three-dimensional pattern.

YE J, BIENER J, CAMPBELL P, CHEN W, JACKSON J A, MORAN B D, OAKDALE J, SMITH W, SPADACCINI C, WORSLEY M A, ZHENG X

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Preparing graphene comprises providing graphite monoxide powder, placing graphite oxide powder into solvent and then heat treating to prepare graphene oxide dispersion liquid, introducing hydrogen sulfide gas of the graphene and reacting.

KANG F, LI B, LV W, TAO Y, WEI W, YANG Q, ZHANG C, ZHENG X