国家/地区 世界知识产权组织（31）
IPC部 C（31）
IPC大类 C09（31）
IPC小类 C09K（31） C08K（17） C01B（15）
H05K（15） C08L（12） H01B（12）
C08J（11） B32B（8） H01L（8）
H01M（8） F28F（7） B82Y（6）
C04B（6） C09D（6） B01J（4）
IPC C09K005/14（31）
发明人 JANG B Z（4） ZHAMU A（3） LEE M（2）
YANG S（2） YU H（2）
公开年 2021（7） 2015（5） 2014（4） 2017（4） 2016（3） 2018（2） 2019（2） 2022（2）
申请年 2014（6）  2020（5）  2015（4）  2016（4）  2018（3）  2013（2）  2021（2）  2022（2） 
专利权人 NANOTEK INST.（4） FUJI POLYMER.（3） GLOBAL GRAPH.（2）

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Method for manufacturing graphene heat-conducting foam cotton, involves drying graphene oxide slurry to obtain graphene oxide, and carbonizing and graphitizing graphene oxide to obtain directionally arranged graphene heat conducting foam.

HAO Z, CAI J, ZHENLIANG H, JINMING T

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Flexible heat transfer material for thermally contacting one cell within a battery pack, comprises a matrix and a filler and the thermal conductivity of the filler is greater than the thermal conductivity of the matrix.

FLANNERY B

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of heat-dissipating composite material used for electronic device, involves e.g. mixing inorganic binder and filler to prepare mixture, heat-treating obtained mixture, and mixing composite particles and polymer material.

CHOA Y H, RYU S H, LIM M S, CHO H B, SONG Y S, CHOA Y, LIMMINSUP, CHO H, SONG Y

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N