国家/地区 中国（175）
IPC部 C（175）
IPC大类 C08（175）
IPC小类 C08L（175）
IPC C08K003/04（95） C09K005/14（59） C09D007/61（38）
C08K003/22（36） C08J005/18（35） C08J007/04（33）
C08L083/04（28） C08L067/02（25） C08K003/38（21）
C08L075/04（20） C08L023/12（16） C09D005/24（16）
C09D007/62（16） C09D175/04（16） C08K003/08（15）
发明人 LIU Y（10） WANG J（8） LI Z（7）
HE Y（6） LI X（6） CHEN J（5）
CHEN Y（5） HU J（5） LI H（5）
WANG Y（5） ZHANG J（5） CHEN C（4）
CHEN R（4） CHEN X（4） LI C（4）
公开年 2022（112） 2023（63）
申请年 2022（175）
专利权人 ANHUI AEROSP.（4） HANGZHOU FUX.（4） UNIV SOUTH C.（3） CHANGZHOU WI.（2）
DONGGUAN JIA.（2） GUANGDE TIAN.（2） JIXIANGBAO T.（2） TAN KAH KEE .（2）
UNIV BEIJING.（2） UNIV GUANGDO.（2） UNIV HARBIN .（2） UNIV JILIN（2）
UNIV QINGDAO.（2） UNIV TSINGHU.（2） UNIV XIAMEN（2） UNIV ZHEJIAN.（2）
ZHEJIANG LAB（2）

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Preparing high-concentricity capillary electrophoresis electrochemical detection disk electrode molten ball, comprises e.g.winding the electrode lead at one end of rod-shaped electrode body, dipping other end of rod-shaped electrode body into molten hot-melt adhesive, and post-processing.

LU B, CHEN C, WU Q, PENG L, WANG L, CHEN G

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Moisture barrier paint used for moisture resistance protection of rigid closed cell polyurethane foam, comprises adhesive, active micro-nano material, sheet-like inorganic material, fluororesin, polypropylene, xylene, propylene glycol methyl ether acetate and additives.

ZHOU C, MA Z, XIANG Y, WU Y, YU B, XU Y, ZHOU F

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X