国家/地区 世界知识产权组织（14）
IPC部 B（14）
IPC大类 B82（7） B32（5） B29（4）
C23（4） G06（4） B33（3）
B41（3） C09（3） C25（3）
H05（3） B01（2） B05（2）
C01（2） C08（2） G01（2）
IPC小类 B82Y（7） B32B（5） B29C（4）
C23C（4） G06F（4） B33Y（3）
C09D（3） C25D（3） B05D（2）
B41J（2） C01B（2） G12B（2）
H05K（2）
IPC B82Y030/00（6） B33Y070/10（3） G06F001/16（3）
B29C064/165（2） B32B033/00（2） B33Y010/00（2）
B33Y080/00（2） C09D005/00（2） C09D175/04（2）
C25D011/02（2） C25D013/06（2）
发明人 WU K（9） CHANG C H（4） CHANG C（2）
HOLDER H A（2） LI Y（2）
公开年 2021（4） 2022（4） 2019（2）
申请年 2021（4）  2019（3）  2020（3）  2018（2） 
专利权人 HEWLETTPACKARD DEV CO LP（14）

Epoxy molding compound used in fluid ejection device for encapsulating fluidic dies, comprises hardener, inorganic based filler, catalyst to accelerate curing of epoxy molding compound, and conductive additive.

SONG B, ZHANG Z

Electrowetting surface used in digital microfluidic device, comprises electrodes comprising layer of conductive material deposited over substrate, and nanoceramic coating comprising ceramic nanoparticles bound together by polymeric binder.

CUMBIE M W, CHEN C, SHKOLNIKOV V

Coated substrate used for electronic device, comprises substrate comprising a metal or metal alloy, basecoat layer on substrate, where basecoat layer comprises pigment particles and one-part thermally cured polymeric resin, and anti-fingerprint topcoat layer on basecoat layer.

WU K, LI Y, CHANG C H, ZHU X

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K

Three-dimensional build material composition for three-dimensional printing, comprises polyamide particles and biodegradable polyester filler particles without any additional filler particles.

DISCEKICI E H, FLEISCHMANN C, WOODRUFF S R, YEMANE A

Substrate coated with thermal management material comprising thermal conductive coat deposited on substrate, and heat insulation coat comprising plant root powder and resin, used in electronic device e.g. computer and laptop.

ANANDAKRISHNAN S, WU K

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Producing coated metal alloy substrate for electronic device by scanning metal alloy substrate to determine three-dimensional surface profile of portion of metal alloy substrate and printing coating layer on metal alloy substrate.

WU K, YEH Y, CHANG C H

Flexible printed article used in wearable device e.g. conductive contact pad, comprises non-conductive, graphene oxide membrane base substrate, and electronic component positioned on non-conductive, graphene oxide membrane base substrate.

IONESCU R C, HOLDER H A, WITTKOPF J A, WORSLEY R, CASIRAGHI C, SHIELDS J P

Cover for electronic device comprises metal cover substrate, transparent passivation layer on top surface of substrate, water-borne graphene coating layer on transparent passivation layer, and electrophoretic deposition coating layer.

WU K, CHANG C H, HSIEH H