国家/地区 中国（10）
IPC部 C（9） H（3） G（2）
IPC大类 C08（6） C09（5） G03（2）
H05（2）
IPC小类 C08K（5） C08L（5） C08J（3）
C09J（2） C09K（2） G03F（2）
H05K（2）
IPC C08K003/04（3） C08L063/00（3） C08J005/18（2）
C08K003/08（2） C08K007/00（2） C08K007/24（2）
C08L075/04（2） C08L083/04（2） C09J007/30（2）
C09J011/04（2） C09J011/06（2） C09K005/14（2）
G03F007/004（2）
发明人 SUN R（9） ZENG X（4） REN L（3）
XU J（3） LAI Z（2） LI J（2）
LIANG X（2） ZHANG G（2） ZHAO T（2）
公开年 2022（6） 2021（4）
申请年 2022（5）  2020（3）  2021（2） 
专利权人 SHENZHEN ADVANCED ELECTRONIC MATERIAL（10）

Ester type photosensitive material polyimide comprises polyamic ester, photoinitiator, crosslinking agent, fluoride quantum dot and solvent.

SUN R, ZHANG G, ZHANG J, LI J

Modified fluorinated graphene quantum dot used in integrated circuit, semiconductor device or display device, comprises curing accelerator modified fluorinated graphite quantum dot, where curing accelerator includes substituted nitrogen-containing heterocyclic compound and substituted amine compound.

SUN R, ZHANG G, WANG T, LI J

Electromagnetic shielding composite material with temperature response characteristics useful for smart temperature control electromagnetic shielding switch of electronic device, comprises vanadium dioxide as functional material, and prepared by compounding with substrate material.

SUN R, ZHU P, HU Y, WANG X, LIAO S, WAN Y

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Hybrid modification of thermal conductive powder used for thermal interface material includes dispersing silane coupling agent modified mixed liquid in thermal conductive powder and dispersing silane coupling agent modified mixed liquid in modified heat-conducting powder.

ZENG X, HE B, WEN Z, PANG Y, XU Y, REN L

Composite insulating film used as packaging material for e.g. substrate and carrier plate comprises dielectric films made of electronic paste coating comprising epoxy resin, curing agent, filler, solvent, and silane coupling agent.

SUN R, YU J, YU S, XU P, LUO S

Polymer composite thermal interface material comprises crosslinking agent, lipoic acid and/or derivative, thermal conductive filler and aluminum salt.

REN L, WANG Z, YE W, ZENG X, SUN R, XU J

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Thermally conductive double-sided adhesive tape includes a substrate, a thermally conductive adhesive film and a release film, and both sides of the base layer are coated with a thermally conductive adhesive film containing holes.

LAI Z, LIANG X, ZHAO T, SUN R

Preparation of thermal interface materials involves immersing graphite powder in acidic aqueous solution, grafting, mixing with e.g. thermosetting resin, applying on release film, peeling, pressing, cutting, and curing.

ZENG X, SUN R, XU J, DENG F, XIN P, REN L, ZHANG C, YE Z