国家/地区 美国（23）
IPC部 H（22） B（11） C（9）
IPC大类 H01（22） B82（6） B32（5）
C01（4） C08（4） C09（3）
H05（3） B29（2） C23（2）
IPC小类 H01L（18） B82Y（6） B32B（5）
C01B（4） C08K（4） C08L（4）
H05K（3） B29C（2） C08G（2）
C09K（2） C23C（2） H01B（2）
H01G（2） H01J（2）
IPC H01L029/78（10） H01L029/16（9） H01L021/336（8）
H01L029/66（7） B82Y040/00（5） H01L029/778（5）
H01L029/786（5） C08K003/04（4） H01L021/02（4）
H01L029/06（4） H01L029/423（4） B32B038/10（3）
B82Y099/00（3） C01B031/02（3） C08K003/34（3）
发明人 KIM Y S（23）
公开年 2014（7） 2021（5） 2013（4） 2015（3） 2023（2）
申请年 2013（7）  2014（5）  2021（3）  2012（2）  2016（2）  2020（2）  2022（2） 
专利权人 SAMSUNG ELEC.（13） TICONA LLC（3） KIM Y（2） LEE J（2）
SEMES CO LTD（2）

Substrate treating apparatus for treating substrate using plasma, has chamber having treating space, support unit positioned within treating space and configured to support substrate, and plasma generation unit configured to generate plasma from process gas supplied to the treating space.

JANG D Y, CHOI S M, KIM Y S, JEON M S, JUNMINSUNG, MIN C S, ZHANG D, CUI S, JIN R, JEON M

Substrate treating apparatus, has plasma generation unit comprising bottom electrode and top electrode opposite bottom electrode, where top electrode comprises plate and electrode layer on plate.

JIN Y J, KIM J H, JANG D Y, CHOI S M, KIM Y S, JEON M S, JUNMINSUNG, MIN C S, YOUNGJO J, JIN Y, KIM J, ZHANG D, CUI S, JIN R, JEON M

Circuit structure comprises substrate comprising polymer composition comprising electrically conductive filler distributed within polymer matrix, and polymer matrix comprises thermoplastic high performance polymer.

KIM Y S

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Solid electrolyte capacitor comprises sintered body containing metal and conductive polymer layer disposed on sintered body.

OH H S, KWON O C, KIM Y S, HONG J H, HONG J, JIN Q, KWON O, OH H

Method for fabricating graphene nano-mesh in e.g. transparent display device, involves forming graphene nano-mesh including openings by etching oxide layer, and transferring graphene nano-mesh onto substrate after removing catalyst layer.

LEE J, KIM Y, LEE C, LEE J H, KIM Y S, LEE C S

Phase change memory device for use in integrated circuits, has graphene layer formed on lower electrode, phase change material layer formed on graphene layer and insulating layer, and upper electrode placed on phase change material layer.

KIM Y, AHN C, SOOD A, POP E, WONG H S P, GOODSON K E, FONG S, LEE S, NEUMANN C M, ASHEGHI M, KIM Y S, AHN C Y, LEE S H, WONG H P

Method of fabricating graphene nano device, involves placing first metal mask pattern prepared in advance on first adhesive layer and heating layer to attach first metal mask pattern on substrate.

JEON E K, KANG H S, LIM K, PARK H J, KIM K, KIM J E, KIM Y S, HEO Y S, LIM K S, KIM K S