国家/地区 韩国（14） 中国（7） 美国（7） 欧洲专利局（EPO）（5） 世界知识产权组织（5）
IPC部 H（13） C（5） B（4）
IPC大类 H01（12） C08（3） B01（2）
C01（2） C09（2）
IPC小类 H01L（8） C08L（3） H01M（3）
B01J（2） C01B（2） C08K（2）
C09D（2）
IPC H01L021/768（4） H01L023/532（4） H01L029/417（3）
H01L029/45（3） H01L029/786（3） C08K003/04（2）
C09D007/48（2） C09D007/61（2） C09D007/63（2）
H01L023/528（2） H01L023/538（2） H01L027/11582（2）
H01L029/06（2） H01L029/16（2） H01L029/40（2）
发明人 LEE S（17）
公开年 2023（9） 2022（8）
申请年 2022（17）
专利权人 SAMSUNG ELEC.（4） AMOSAINS FUN.（3） INTEL CORP（2） UNIV SEOUL N.（2）

Fabricating semiconductor device involves loading substrate with structure having opening, into process chamber, forming two-dimensional material layers on upper surface of structure, to overlie opening and form air-gap, where upper portion of air-gap, is defined by two-dimensional material layers.

SHIN K, LEE S, YOON J, AN S, LI Z, YOUN J, AN X, AHN S J, SU Y J, LEE S Y, SHIN K W

Catalyst useful for producing hydrogen comprises aluminum oxide or activated carbon, platinum supported in pores of aluminum oxide or activated carbon, and molybdenum mixed with platinum and supported in pores.

LEE K, JISU J, KIM C H, PARK T, LEE S, JANG J S, PARK T I

Radio frequency (RF) connector for use in e.g. communication facility, has shielding structure that is provided on one surface other than surface to which magnets of first structure and magnets of second structure are attached to each other.

LEE S, CHANG K, CHAE J, CHOI H, LEE S J, KONHEE C, CHAE J H

Electronic device for use in electronic apparatus, has two-dimensional material layer formed between channel layer and gate electrode, where material layer blocks electron transfer between gate electrode and channel layer.

SHIN K, BYUN K, LEE S, KIM C, LEE C, LI C, JIN C, SHIN K W, BYUN K E, LEESANGSOO, LEE C S

Attachable microphone for microphone array, has substrate having back chamber with first tubular hollow, and first frame member surrounding back chamber and containing first polymer or inorganic material; and back plate unit.

CHO K, MOON W, LEE S, KIM J, CHO K W, MOON W K, KIM J S

Integrated circuit structure for use in computing device, has graphene layer including first side coupled to conductor, and second side perpendicular to first side, and two-dimensional transition metal dichalcogenide layer coupled to base.

NAYLOR C, MAXEY K, OBRIEN K, DOROW C, LEE S, PENUMATCHA A V, AVCI U E, METZ M, CLENDENNING S B, METZ M V, OBRIEN K P, NAYLOR C H, KIRBY M, CHELSEA D, RISUDARAT, VERMA P A, ABSIYUGARI, BEE C S, ARFCHI U E

Surface finishing material used for furniture, comprises low preure melamine attached on top of furniture board and surface protective layer formed using coating solution applied and dried on surface of low preure melamine.

LEE S

Interconnect structure for use in electronic device, has graphene-metal barrier including graphene layers and metal particles on grain boundary of each graphene layer and between graphene layers, and conductive layer formed on barrier.

LEE S, SHIN H, KIM H, KIM K, SHIN K

Interconnection structure, has graphene layer arranged between first graphene layer and second graphene layer, where second graphene layer is arranged between conductive feature and dielectric material.

SUI X, ZHANG X, HUANG X, YANG G, CAI C, LEE S, LI S, SHUE S, CHANG H, HUANG H, YANG K, TSAI C, LEE C

Integrated circuit structure for use in computer platform, has interconnect structure coupled to transistors, and graphene fixed over top surface of first metal, where first metal is copper, ruthenium cobalt and molybdenum or tungsten.

NAYLOR C, CHAWLA J, METZ M, KING S, CHEBIAM R, KOBRINSKY M, CLENDENNING S, LEE S, JEZEWSKI C, CHUGH S, BIELEFELD J, CHU S, KIM S