国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08K（14） C08L（12） C09K（7）
C01B（6） C08J（6） C09D（5）
B82Y（4） C09C（4） C08G（3）
H01L（3） B01J（2） B29C（2）
B32B（2） B33Y（2） B60C（2）
IPC C08K003/013（14）
发明人 IFTIME G（2） JUNHUA W（2） PANDEY R（2）
WEI J（2）
公开年 2021（8） 2022（4） 2020（2）
申请年 2021（6）  2020（4）  2019（3） 
专利权人 FUJI POLYMER.（2） PALO ALTO RE.（2）

Heat-dissipating lamp housing includes a housing body and a heat-dissipating paint coated on the housing body made of melamine powder, aluminum powder, silicon powder, ceramic polishing slag, medical stone, and talc powder.

YAO Z, ZHANG Y, YAO H

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Composite resin composition used for manufacturing composite resin coated steel sheet, comprises main resin comprising modified polyester resin, curing agent, pigment containing rust preventive pigment, catalyst containing acid catalyst, wax, and solvent.

JO D, PARK Y, EUN H, JO D H, JAE E H

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Filament material for marking three-dimensional (3D) printed object, has polymer resin (compatible with extrusion based printing process), and marking additive that allows portions of filament material to change color when exposed to light.

HU N X, HU N

Producing polyurethane foam, comprises dispersing turbostratic graphene in a polymerization solution, and adding second component for polymerizing with the first component to chemically convert polymerization solution into polyurethane foam.

MANCEVSKI V, VLADIMIR M