国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08K（14）
IPC C08K003/04（14）
发明人 LIU P（3） FENG Y（2） SUN P（2）
TANG G（2） TANG H（2） TANG W（2）
WANG L（2） XIE X（2） ZHAO L（2）
ZHAO Q（2） ZHENG F（2）
公开年 2020（4） 2017（3） 2022（2）
申请年 2017（3）  2019（3）  2020（3）  2018（2） 
专利权人 CHINA PETROL.（2） SINOPEC BEIJ.（2）

Rubber composition for thermally conductive rubber material, preferably vulcanization bladder, comprises masterbatch, first reinforcing filler, second reinforcing filler, vulcanizing agent, vulcanization activator, plasticizer, and vulcanization auxiliary agent.

TANG H, ZHENG F, LIU P, SUN P, TANG G, WANG L, XIE X, ZHAO Q

Rubber composition for heat conductive rubber material, that is vulcanized capsule, comprises master batch, reinforcing filler, vulcanizing agent, vulcanizing activator, plasticizer and vulcanizing auxiliary agent.

TANG H, ZHENG F, LIU P, SUN P, TANG G, WANG L, XIE X, ZHAO Q

Graphene blended modified phase change foamed thermal insulation material includes graphene blended modified phase change large capsule and polyurethane foam material.

OU B, PAN L, WANG C, LU L, HAN P

Thermosetting resin composition comprises thermosetting resin matrix, graphene nanosheets and one-dimensional linear thermal conductive bridging filler.

XU H, XU W, WANG J, ZHAO L, LIU T, MA Q, LI J

Resin composition comprises epoxy resin, bisphenol A, phenolic resin and inorganic filler, inorganic filler comprises metal oxide, metal nitride, metal carbide, and/or graphene in metal hydroxide.

LIN C, CAI X, YANG G, LIANG Y, GAO Y, SU J

Graphene thermally conductive plastic structure for electric vehicle chargers comprises charger body and charger housing and charger case is an integrated molded body.

NI J, CHEN W, ZHANG F, TAO X, FENG Y

Graphene composite heat conductive material comprises heat-conducting inorganic filler, graphene nano-microchip, and phenolic resin.

FENG Y, TANG W, HU H

High stacking degree graphene modification based high thermal conductivity carbon plastic alloy useful in industrial heat dissipation, illumination heat dissipation and heat dissipation of electronic devices, comprises e.g. coupling agent.

HUANG W, ZHAO L, LIN L, SUN D, ZHANG B, LIN J

Preparing nylon heat-conducting material involves weighing nylon resin, oxide filler, protective filler, thermal filler, nano-graphene, aluminum fiber, flame retardants, plasticizers, tackifiers, coupling agents, and antioxidants.

CAI Y

Preparation of composite low thermal conductivity material involves adding material formed of graphene composite system, material formed of fullerene, and material formed of polystyrene, to film making machine, and hot-pressing.

HAN J, LIANG G, WANG Z