国家/地区 中国（15） 世界知识产权组织（5） 韩国（2）
IPC部 C（20）
IPC大类 C08（20）
IPC小类 C08L（20）
IPC C08L063/00（20）
发明人 LEE E J（2） LEE K（2） LEE K D（2）
NAM C R（2） PAN Z（2） SEO M K（2）
SONG J（2） SONG J H（2） ZHOU M（2）
公开年 2022（11） 2023（9）
申请年 2022（20）
专利权人 ANHUI AEROSP.（2） HANSOL CHEM .（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing insulating and heat-dissipating paint by adding resin diluent and solvent to matrix resin, stirring, adding amine neutralizer, additives, fumed silica, silane coupling agent and insulating and heat-dissipating fillers to pretreated matrix resin, stirring and combining with ground carbon.

LIN Y, LI K

Composition used for forming coating material, comprises curable resin and/or its precursor, inorganic particles, and graphene having preset average thickness.

KATO T, TAMAKI E

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J

Aging-resistant invisible car coating film with self-repairing function to protect vehicle paint, comprises base film layer comprising thermoplastic polyurethane coating resin, transparent soft glue, calcium carbonate, aluminum oxide, graphene, and barium zinc stabilizer, and self-repairing layer.

WEI X

Modified inorganic particle useful in preparing epoxy resin, prepared by e.g. modification of tannin-based aqueous derivatives and carbon black, carbon nanotubes, ultrasonically dispersing tannin-based aqueous epoxy-modified nanoparticle in water and post-processing.

NIE X, HUANG J

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X

Heat dissipation composite composition used for forming heat dissipation composite, comprises epoxy resin, and phase change material, and includes polymer matrix formed by chemical bonding of epoxy resin and phase change material.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Manufacturing heat dissipation composite by melting and stirring epoxy resin, phase change material, and curing agent, curing at temperature higher than curing temperature of epoxy resin to form matrix, and simultaneously performing secondary main curing and high-density compression processing.

SEO M K, LEE E J, SONG J H, LEE K D, NAM C R, SONG J, LEE K

Thermally conductive composition used in thermally conductive material for electronic devices for e.g. printed wiring board, transistors, driver integrated circuit chips, and memories, comprises resin, and carbon-based material whose surface is coated with inorganic substance.

KASUE A