国家/地区 中国（11） 韩国（2） 美国（2） 世界知识产权组织（2）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08L（11） C08K（10） C09K（7）
C08G（4） C08J（3） B32B（2）
B82Y（2） C09J（2） H01B（2）
IPC C08L063/02（11）
发明人 LI J（3） CHEN Y（2） LI Y（2）
LIU L（2）
公开年 2021（4） 2023（2）
申请年 2021（3）  2014（2）  2020（2）  2022（2） 
专利权人

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H

Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.

LI J, YI X, CUI K, DING H, XIE H

Ultra-high isotropic heat-conducting material comprises epoxy resin, two-dimensional sheet-metal nanofiller two-dimensional flake-carbon-based-thermally conductive filler, and thinner.

YANG S, WANG X, WANG Q, BAI S

Preparing flame-retardant epoxy resin composite material with simultaneous microwave peeling and intercalation of organically modified nano two-dimensional materials comprises mixing two-dimensional material and deionized water.

WU Z, DU J, GUO J, FAN Q

Preparing graphene epoxy resin composite material for conductive materials and thermally conductive materials application by ultrasonically dispersing graphene oxide and reducing agent in deionized water, sealing and heating.

WANG Y

Preparing graphene-epoxy composite material involves dissolving graphene oxide deionized water, ultrasonically dispersing obtained solution, and adding dopamine into solution.

CHEN Y, LIU X, LUO J, ZHU R

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y