国家/地区 中国（17）
IPC部 C（17）
IPC大类 C09（17）
IPC小类 C09J（17）
IPC C09J183/04（17）
发明人 LI X（3） GUO C（2） LUO W（2）
WANG L（2）
公开年 2021（17）
申请年 2021（10）  2020（7） 
专利权人

Adhesive tape used for fixing flexible circuit board comprises release film, first adhesive layer (e.g. tripropylene glycol diacrylate), base material layer (polyethylene terephthalate polyester slice), second adhesive layer (acrylate and maleated rosin), and foam layer (polyethylene particles).

GUO Y

High performance resin-based adhesive used in metal base material comprises bismaleimide resin, polyimide modified epoxy resin, end hydroxy liquid polybutadiene rubber, organosilicone rubber, end isocyanate based polyurethane, amine curing agent, curing accelerator, coupling agent, and filler.

ZHOU X, FENG H

New-type high temperature resistant graphite radiating adhesive tape for use in production process of electronic product, has adhesive tape base layer whose lower part is provided with graphite layer.

ZHANG Z, JIANG S

Condensed two-component organic silicon pouring sealant comprises alpha, omega-dihydroxy polydimethylsiloxane, plasticizer, carbon nanotube fiber, silicon carbide whiskers, zirconia, graphene and boron nitride, crosslinking agent, coupling agent, catalyst, and plasticizer.

ZHENG Y, LIAO J

Safety silica gel ceramic protective coating comprises ceramic main component whose outer wall surface is sprayed with silica gel protective coating including silica gel and thickener, and porcelain-silicon bonding layer arranged between ceramic main component and silica gel protective coating.

XIANG C

Heat conducting gasket comprises heat conducting films formed with through holes passing through surfaces of heat conducting film, where through holes are distributed with adhesive.

SHI Y, GE X, LI F, LU J, LI Z, ZHOU B

Graphene heat dissipation potting composition used for forming graphene heat dissipation potting glue used for forming heat dissipation module, comprises resin, thermally conductive powder, functionalized graphene oxide, dispersing agent, coupling agent, curing agent and defoamer.

LI H, LI Q, TAO Y, SUN J, SONG Y

Low-temperature curing conductive adhesive for solder joint or seam, comprises liquid metal conductive particles, thermosetting resin, organic acid activator, corrosion inhibitor, thixotropic agent, solvent, curing agent.

XU P, WANG S, LIU S

Conductive welding glue useful in conductive double-faced adhesive tape for manufacturing lithium battery, comprises substrate, conductive polymer and inorganic conductive agent.

LI W, LI X, GUO C

Manufacturing heat-generating silica gel sheet useful for heat-generating glove, pad and mask, comprises e.g. coating heat-generating graphene sheet with adhesive, injecting silica gel into mold, fixing in shaping fixture, and removing burr.

LI J