国家/地区 美国（9）
IPC部 C（9）
IPC大类 C25（9） C01（6） B32（3）
B01（2） B82（2） H01（2）
IPC小类 C25F（9） C01B（6） B32B（3）
B82Y（2） C25D（2） H01L（2）
IPC C25F007/00（9）
发明人 GUO L（4） HAN S（4） LI X（4）
公开年 2014（4） 2017（2）
申请年 2012（2）  2017（2） 
专利权人 INT BUSINESS.（4）

Processing superabrasive element by e.g. leaching metallic material from volume of polycrystalline diamond table, and leaching central portion of superabrasive face and region adjacent to superabrasive side surface of superabrasive element.

BOND O D, CHAPMAN M P, LYNN J B, HEATON D N

Treating electrolyte by feeding electrolyte containing two metal ions into electrochemical polishing reactor with anode and high-surface area cathode and controlling electrode potential at high-surface area cathode to reduce first metal ion.

MOHANTA S, REILL J, TAECKER B S, HOKE J, DOUGHERTY B J, LIAO J, LIL J, TACKER B S, HAWK J, DIRTY B J, LAYER J

Production of graphene film used in nanoelectronics, involves forming catalyst film on conductive support, forming graphene film on catalyst film, and electrolytically removing catalyst film from support.

BOTTE G G

Electrochemical etching apparatus used on metal substrates, has electrically conductive polymer that couples metal plate to graphene layer of anode, such that polymer and graphene layer are set between metal substrate layer and metal layer.

GUO L, HAN S, LI X

Electrochemical etching method used for metal substrate involves forming electrically conductive polymer on graphene layer such that metal plate is coupled to graphene layer, then disposing metal substrate layer in electrolyte.

GUO L, HAN S, LI X

Method for forming nanopore in graphene membrane in liquid environment, involves applying nanopore diameter tuning voltage pulse between membrane surfaces if electrical conductance is greater than prespecified electrical conductance.

GOLOVCHENKO J A, LU B, KUAN A T, GOLOVCHENKO J, KUAN A

Electrochemical etching method for removing metal substrate layer from graphene layer, involves connecting graphene layer or metal substrate layer to power source to supply current to etch metal substrate layer from graphene layer.

HAN S, GUO L, LI X

Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.

HAN S, GUO L, LI X

Apparatus for manufacturing device used for preparing graphene for electronic circuit, comprises graphene structure including metal catalyst layer formed on substrate, protection layer, and graphene layer, and power unit.

LEE J, JUNG Y, KIM Y, LEE C, MOON C, LEE J H, JUNG Y S, KIM Y S, LEE C S, MOON C Y, MUN Z R