国家/地区 美国（13）
IPC部 C（13）
IPC大类 H05（13） C08（9） H01（9）
C09（7） C01（3） B32（2）
IPC小类 H05K（13） C08K（6） C08L（5）
C09D（5） H01L（4） C01B（3）
C08G（3） H01B（3） B32B（2）
IPC H05K009/00（13）
发明人 ALEKSOV A（2） EID F（2） ELSHERBINI A A（2）
LIU X（2） STRONG V A（2） SWAN J M（2）
公开年 2021（13）
申请年 2021（5）  2020（4）  2019（3） 
专利权人 INTEL CORP（2）

Microelectronic package used for electrical device e.g., handheld or mobile electrical device comprises a die, and package substrate which comprises electrostatic discharge protection material including electrically-conductive carbon allotrope and electrically-conductive polymer.

EID F, ELSHERBINI A A, ALEKSOV A, SWAN J M, STRONG V A

Electromagnetic interference shielding material useful for EMI shielding applications on electronic devices and circuit boards, comprises biopolymer or polymer dissolved in organic solvents, and shielding guest materials comprising particles, powders, tubes or rods, flakes, fiber or sheets.

GROTE J G, SALOUR M M, ZANG D Y

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Composite material for shielding or absorbing electromagnetic wave in e.g. smart phone, has electromagnetic absorbing material comprising silicon carbide, and conductive material comprising two-dimensional carbon material containing graphite sheet and graphene sheet.

CHU Y S, KE Y, HSIEH C, HSIEH I, HO H, LIU W, ZHU J, XIE Z, XIE Y, HE X, LLKE Y, LLCHU Y S

Invisible ice-covering-proof compatible material useful as surface material of equipment, comprises insulating and heat insulating layer comprises e.g. polyimide, glass fiber, hollow glass microsphere and/or polyurethane and patterned heating, insulating heat conducting and hydrophobic layer.

MA Z, ZHAN X, WANG Z, ZHAO Z, ZHU Y, CHEN J, LIU X, CHEN H

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Combination useful in laminate structure, comprises non-conductive polymer, filler and saline, where filler comprises material e.g. graphene, saline comprises acrylate polymer having wet end and dry end and wet end can bond with filler.

PU V D

Electromagnetic interference shielding film for flexible printed circuit board, consists of conductive adhesive layer formed using composition comprising acrylate solution, divalent acid ester solution, conductive particles and solvent.

YU P, LIU H, CHANG Y, HUANG S, YOU B, LIU X, ZHANG Y

Preparation of graphene oxide platelet-filled polyimide film for electronic devices, involves mixing graphene oxide platelets with polyimide precursor material and liquid to form slurry, forming wet film from slurry, and imidizing film.

HSIAO M, ZHAMU A, JANG B Z