国家/地区 中国（18）
IPC部 C（18）
IPC大类 C09（18） B32（6） H01（5）
C08（3） H05（3）
IPC小类 C09J（18） B32B（6） C08K（3）
C09D（3） H01L（3） H05K（3）
H01M（2）
IPC C09J201/00（18）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） LU J（2）
公开年 2022（8） 2021（4） 2019（2）
申请年 2021（7）  2020（4）  2016（2）  2019（2） 
专利权人 LINTEC CORP（3） LU J（2）

Polar ear glue structure useful in battery, comprises pole ear glue main body comprising pole ear glue core film layer, where upper and lower sides of pole ear film layer are symmetrically provided with glue layer, and polypropylene connecting layer provided on side of glue-proof layer.

HE S, YI H, LIU W

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Negative ion functional plate comprises upper surface layer plate, lower surface plate and core layer plate, and rubber layer capable of releasing negative ion.

YUAN C, HAO X, CHEN J, SHI L, ZHANG W, WANG H, LI Q, ZHANG J, YUAN S

Adhesive tape used for electronic products, comprises release layer, adhesive layer, base material layer, antioxidant layer, buffer layer, flame retardant layer, antistatic layer and insulating layer.

GU L

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Hybrid adhesive composition useful for electromagnetic wave shielding, comprises conductive metal particles, graphene, adhesive resin and curing agent, where graphene is chemically modified graphene, and adhesive resin is bonded to functional group of chemically modified graphene.

KIM M G, HONG S M, OH J T, KIM J H, KIM J, OH J, HONG X, KIM M, MYEONGGI K

Seed crystal adhesive used for seed crystal bonding, comprises adhesive and graphene.

HUANG X, ZHAO X, LUO Y, YANG M

Glass fiber cloth reinforced thermosetting copper-clad plate comprises glass fiber cloth, and copper foil bonded with resin adhesive on one or both sides of glass fiber cloth, the resin adhesive is formed by mixing adhesive and flame retardant and surface of copper foil is coated by coating.

CHEN M, WANG L, HE W, ZHAN H

Positive temperature coefficient heating body packaging structure; graphene conductive adhesive used in packaging structure comprises e.g. far-infrared emitting agent, copper powder, and high temperature resistant high molecular materials.

LU J