国家/地区 美国（5） 中国（4） 台湾（4） 德国（3） 世界知识产权组织（3） 韩国（2）
IPC部 C（10）
IPC大类 C01（10）
IPC小类 C01B（10）
IPC C01B032/182（10）
发明人 ATIAS B（3） LEVI A（3） MENTOVICH E（3）
NAVEH D（3） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） HE M（2） HUANG C（2）
HUANG H（2） LIPP E（2） ROTEM Y（2）
公开年 2022（10）
申请年 2022（6）  2021（3） 
专利权人 MELLANOX TEC.（3） UNIV BARILAN（3） CTRON ADVANC.（2） PCB TECHNOLO.（2）

Method for maintaining temperature adaptability by terminal, involves analyzing temperature information of collected screen, and controlling heating device to heat according to analysis result and conducting heat to screen through graphene radiating material layer and eccentric heat pipe shaft.

QI Y, SUN Y, QIN X

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Upper electrode assembly used in plasma processing apparatus, has heat transfer sheet that is mounted between electrode plate and metal plate and having vertically oriented portion with vertically oriented graphene structures.

TSUJIMOTO H, KOBUNE T, LI L, LEE L, KOBUNEDAKAKI

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Plasma enhanced chemical vapor deposition method used in semiconductor structure, comprises turning on radio frequency source of radio frequency system to decompose aromatic hydrocarbon precursor into multiple active radicals at specific frequency to form graphene layer on magnetic layer.

WU Z, NI I, XU Y, HUANG J, WU C, HSU Y, HUANG J Z, HSU Y H

Functional film useful e.g. as multifunctional film for wearable electronic devices and electronic circuit, comprises graphene nanoplatelet and aramid nanofiber.

KIM S, VU M

Preparing graphene composite nano-hexagonal barium ferrite wave-absorbing material comprises mixing nano M-type barium ferrite powder with hexagonal molecular structure with glucose particles, adding water, grinding, drying, vacuuming, introducing nitrogen, and microwave heating and cooling.

ZHANG Y, ZHENG L, ZHENG P, LI R, ZHENG H