国家/地区 美国（33）
IPC部 C（33）
IPC大类 C08（33）
IPC小类 C08L（33）
IPC C08K003/04（25） C08L101/00（11） H05K009/00（11）
H05K001/03（10） H05K007/20（8） C01B031/02（6）
C01B031/04（6） C01B032/182（6） C08L063/00（6）
C09D005/24（6） H01B001/24（6） C08J005/18（5）
C08K003/34（5） C08K007/00（5） C08L023/12（5）
发明人 JI S Y（4） KIM S H（4） HAM S J（3）
CHEN J（2） CHI S（2） FU Y（2）
HASEGAWA S（2） HASEGAWA SHOJI（2） JANG B Z（2）
JEAN B（2） JIN R（2） KAMIYA N（2）
KAMIYA NAGISA（2） KIM S（2） KIM Y S（2）
公开年 2021（12） 2015（5） 2013（4） 2012（3） 2014（2） 2016（2） 2018（2） 2022（2）
申请年 2021（6）  2014（5）  2013（4）  2019（4）  2020（4）  2011（3）  2012（2）  2015（2）  2017（2） 
专利权人 SAMSUNG ELEC.（5） GLOBAL GRAPH.（2） GRAPHENE PLA.（2） GRAPHENE PLA.（2）
IND TECHNOLO.（2） NANOTEK INST.（2） TICONA LLC（2）

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Composition for forming article e.g. seals, comprises matrix polymer chosen from thermoplastic polymer and curable polymer having functional group for crosslinking, and three-dimensional, branched and/or crosslinked carbon nanostructure additive provided in amount such that after forming article.

REICHL G, GUREVICH E, PERIYASAMY M, QUARTAPELLA C J, PIACENTE N P, LYNN B

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Resin composition used to prepare prepreg for metal-clad laminate for preparing printed circuit board, comprises bismaleimide compounds and vinyl-containing elastomer.

CHIANG J, CHIOU J, LIU S

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Polymer-polymer-positive-temperature-coefficient-material for use in e.g. graphene-filler-component, comprises polymer-matrix, polymer, and/or polymeric-containing material.

ZHOU Z, FU Y, CHEN J, JOE J, HU Y

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y