国家/地区 中国（32）
IPC部 C（32）
IPC大类 C23（32）
IPC小类 C23C（32）
IPC C23C016/26（32）
发明人 ZHANG J（4） CHEN Z（3） LIU Y（3）
WANG X（3） ZHANG Z（3） GUO X（2）
HE P（2） JIN K（2） LI F（2）
LI Q（2） WANG L（2） WANG M（2）
WANG Y（2） WU W（2） YANG C（2）
公开年 2020（5） 2015（4） 2016（4） 2017（4） 2021（3） 2022（3） 2011（2） 2014（2） 2018（2） 2019（2）
申请年 2015（6）  2019（5）  2016（4）  2021（4）  2017（3）  2022（3）  2013（2）  2020（2） 
专利权人 CHINA DONGFA.（2） UNIV SOUTHEA.（2）

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Preparation method of carbon material used in e.g. micro-circuit, involves obtaining carbon material on surface substrate when conductive medium is solid substrate.

DONG Q, BAI W, CHU D, HE Y

Method for in-situ growth of graphene film on nickel-plated surface of copper metal substrate by laser useful in production, transportation involves pre-coating different solid carbon source on copper-nickel alloy coating, and realizing in-situ growth of graphene film by different types of laser.

CHEN M, QI M, QIANG H, ZHENG X, YE X

Preparation of graphene-encapsulated ultra-thin nickel-63 radiation source film used in preparation of Schottky junction stacked radiation cell, involves preparing nickel chloride film, and putting graphene/nickel chloride/graphene film in vacuum environment for reduction treatment.

WANG X, WANG L, CHEN Z, YANG Y, ZHANG J, SU C, FENG H, LI P, WU W, LUO T, ZHOU C

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Preparing polypyrrole nanowire interface modified three-dimensional graphene/polydimethylsiloxane composite photothermal material comprises e.g. cleaning nickel foam, ultrasonicting, washing with deionized water, and drying with nitrogen.

ZHANG B, QIU Y

Flexible complex film comprises nano porous gold film layer, polypyrrole layer, nano gold particle embedded in polypyrrole layer and graphene layer, prepared e.g. by preparing nano porous gold film by removing alloying free corrosion method.

HOU Y, ZHANG H, YANG Y, ZHANG J, GUO J

Preparing low-temperature hydrophobic heat exchange material based on stainless steel and graphene comprises e. g. plating copper or nickel on surface of stainless steel and performing chemical plating or electroplating.

ZHANG Z, YANG D, HE P