国家/地区 中国（31）
IPC部 C（31）
IPC大类 C25（31） C23（3） B05（2）
B22（2） C01（2） C09（2）
H05（2）
IPC小类 C25D（31）
IPC C25D005/18（31）
发明人 HUANG Y（6） JIE X（5） ZHANG L（5）
MAI Y（4） CHEN J（3） LI Q（3）
LIU H（3） ZHOU M（3） CHEN Z（2）
HE Y（2） HU Z（2） LI H（2）
LI J（2） LI X（2） LIU S（2）
公开年 2018（8） 2015（4） 2019（4） 2022（4） 2021（3） 2023（3） 2017（2） 2020（2）
申请年 2018（7）  2017（6）  2021（5）  2022（4）  2015（3）  2014（2）  2019（2）  2020（2） 
专利权人 UNIV GUANGDO.（4） HUANG Y（3） SICHUAN JUCH.（3） UNIV GUANGXI.（2）
UNIV NANJING.（2）

Preparing nano-copper/graphene composite coating using pulse brush plating technology comprises e.g. sensitizing the graphene surface, preparing the suspension, adding surfactant, performing electroless copper plating, ultrasonically stirring, and adopting brush plating solution to prepare coating.

WANG J, QIAO Y, WANG X, LIU S, ZOU Y, ZHAO G

Preparing graphene reinforced metal/alloy composite material, involves orienting solution containing graphene and metal ions, keeping spreading state of graphene unchanged, and co-depositing graphene and metal or alloy on cathode plate.

HUANG Y, LANG H, PENG Y

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.

MIAO H, ZHU K

Preparation of copper-tungsten graphene-containing composite material for vacuum switch electric appliance, involves preparing tungsten-copper-graphene core-shell powder, and sintering obtained graphene core shell powder.

DING Y, ZHU Z, LIANG S, ZOU J, XIAO P, CHEN Z, ZHANG Q, DENG N

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Mercaptobenzene functionalized graphene/copper composite thermal conductive coating for electronic and biological applications, comprises graphene functionalized by mercaptobenzene and chemically connected with nano-copper through mercaptobenzene molecular junction.

ZHENG Q, LI X

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Preparing double-pulse electroplating nickel-graphene composite plating layer of continuous casting crystallizer comprises processing crystallizer copper plate before electroplating, and preparing graphene oxide solution by Hummers method.

FENG T