国家/地区 中国（9）
IPC部 C（9）
IPC大类 C22（9）
IPC小类 C22F（9）
IPC C22F001/08（9）
发明人 DING Z（2） HUANG Z（2） LIU K（2）
WANG E（2） YUE X（2） ZHANG Z（2）
公开年 2021（4） 2022（2）
申请年 2021（6） 
专利权人 SONGSHAN LAK.（2）

Preparing tellurium-copper alloy material containing rare earth metal comprises e.g. taking pure copper, pure tellurium, copper-rare earth alloy and mix, melt, add pure zinc, copper-phosphorus alloy as deoxidizer, solution treating, aging, and electroplating to form coating.

ZHU Y

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W

Preparation of high temperature resistant copper wire includes calcining magnesium, chromium, titanium, nickel and copper to obtain metal mixture, casting metal mixture into ingot, forging ingot to strip copper core and spraying electroplated copper wire with high-temperature resistant coating.

QIAN G, XU H, SUN F, LAI S

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Composite material comprises copper matrix and graphene and carbon nanotubes oriented distributed in the copper matrix.

YANG M, LI T, LIU W, WANG Y, HOU H

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Preparation of composite heat dissipation material used in e.g. computers, involves dispersing copper and graphene powder and carbon nanotubes into absolute ethanol solution, depositing, annealing, and cooling.

HU X

Preparation of graphene crystal domain involves forming copper-nickel double sided substrate, introducing hydrogen, reacting, introducing carbon source, growing graphene crystal domain, introducing argon gas and cooling.

YANG C, WU T, LU G, ZHANG X