国家/地区 中国（6） 美国（6） 台湾（3）
IPC部 F（11）
IPC大类 F28（11）
IPC小类 G06F（11） F28D（7） F28F（7）
H01L（7） H05K（7） B23P（2）
C01B（2） H01M（2）
IPC G06F001/20（11）
发明人 ZHENG Z（2） ZHONG M（2）
公开年 2021（4） 2022（4）
申请年 2020（4）  2022（3） 
专利权人 LAUREL ELECT.（2）

Aluminium graphene uniform temperature plate for flat computer internal heat dissipation, has graphene layer arranged between aluminum-based upper plate and aluminum-based lower plate, and cross-linking holes provided with aluminum-based connecting particles.

WANG G, XU X

Uniform temperature device, has base plate comprising first surface and second surface opposite to first surface, heat conducting piece arranged on first surface of substrate, and radiation layer arranged on second surface.

ZHONG M, ZHENG Z

Uniform temperature device i.e. stacked uniform temperature equalizing device, has set of heat conducting pieces arranged on first surface of base plate, and radiation layer arranged on second surface of plate.

ZHONG M, ZHENG Z

Thermal management device for electronic device, has bracket that is provided with clamping portion that holds heat pipe by side exterior surfaces of heat pipe, and that does not extend past first exterior surface of pipe.

HUANG H, WU K, CHANG C H

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Heat dissipating device, disposed on circuit board, comprises first glue layer, disposed on circuit board, first graphene composite heat dissipating layer, second glue layer, second graphene composite heat dissipating layer, and resin layer.

CHANG C F

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Computing device comprises a set of components that includes a conductive sheet, which is provided with first graphene layer to dissipate a portion of heat, and second graphene layer that is used as an electrical ground.

MORRISON J T, FILES J W, NORTH T C

Graphene-based heat dissipation system for e.g. portable microelectronic device, has heat-conducting layer comprising sheet of integrated graphene film, which shields component or external surface of electronic device from heat.

ZHAMU A, WANG M, XIONG W, JANG B Z