国家/地区 中国（9） 韩国（3） 世界知识产权组织（2）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08G（12）
IPC C08G073/10（12）
发明人 CHEN C（2） WANG D（2） YANG L（2）
ZHAO J（2） ZHAO X（2） ZHOU H（2）
公开年 2023（12）
申请年 2022（7）  2023（4） 
专利权人 PI ADVANCED .（2） UNIV JILIN（2）

Producing polyimide powder used in display, automobile, medical, battery, and aerospace, involves preparing polyamic acid solution, preparing polyimide mixed solution by heating polyamic acid solution, and filtering and drying precipitate present in mixed solution to obtain polyimide powder.

LEE H S, YANG M S, LEE I S, LEE H, YANG M

Preparing polyimide-based shape-memory composite aerogel by carrying out polycondensation reaction of diamine monomer and dianhydride monomer in N-methylpyrrolidone, placing obtained polyamic acid gel in water, freeze-drying, and dispersing polyamic acid filaments and graphene oxide in water.

LI L, GUO M, LIU T

Shape memory polyimide aerogel used in heat insulation, comprises polyimide precursor which is prepared by polycondensation reaction using diamine and dianhydride monomers, followed by sol-gelation, freeze-drying and thermal-imidization.

ZHANG W, LI J, ZHANG L

Preparing flame-retardant conductive composite polyimide film involves adding phosphorus flame retardant material into deoxidizing solvent, performing high power ultrasonic treatment to obtain uniform second filler dispersion, and coating composite polyamic acid solution on substrate.

LIU S, HAN C, TANG Z, LIU C, BEI R

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Polyimide film used in multilayer film and flexible metal clad laminate, is obtained by imidizing polyamic acid solution containing dianhydride component including e.g. biphenyltetracarboxylic dianhydride, and diamine component including e.g. m-tolidine, and comprises graphene nanoplatelets.

JEON J, YEO M, BACK S, LEE K, CHUN J, BAEK S, LEE K N

Preparing high temperature resistant thermosetting supramolecular shape memory polyimide used in aerospace, has e.g. mixing graphene oxide, organic solvent, diamine and dianhydride and polycondensing, subjecting borate-terminated polyamic acid solution to solvent removal and thermal imidization.

WANG T, ZHANG Y, WANG X, WANG Y, ZHANG X, ZHANG N, WANG Q, YANG Z

Preparing polyimide film comprises e.g. mixing film polyimides, thermally conductive fillers and solvents, uniformly dispersing to obtain mixed dispersion, and coating the dispersion on substrate, and synthesizing by polymerization.

NIU S, SUN X

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing graphene-doped polyimide powder used e.g. in lost foam casting, comprises e.g. mixing and reacting graphene with organic solvent, diamine and dianhydride by in-situ polymerization, adding e.g. catalyst, performing chemical imidization of polyamic acid, and grinding polyimide product.

MIN Y, QIU W, LUO X, LIU Y