国家/地区 中国（12） 美国（2）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08G（14） C08K（10） C08L（8）
C08J（4） C09D（3） B82Y（2）
C08F（2）
IPC C08G073/12（14）
发明人 WANG H（3） YAN H（3） FENG Y（2）
JIA Y（2） LIU H（2） YANG Y（2）
ZHANG M（2）
公开年 2021（4） 2012（2） 2016（2） 2018（2）
申请年 2012（3）  2015（3）  2018（2）  2020（2）  2021（2）  2022（2） 
专利权人 UNIV NORTHWE.（3） UNIV LANZHOU.（2）

Composition used to produce thermoset composite material comprises cyanate ester comprising difunctional cyanate ester compound and polyfunctional cyanate ester moiety and substituted bisimide compound comprising biscitraconimide compounds.

LA DELFA G, FOURNIER J, ABGOTTSPON M, MAYERHOEFFER U, ELLINGER S

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Preparation of composite material with friction resistance includes dispersing graphene oxide in N,N-dimethylformamide polar solvent, adding dimethyl 4,4-diphenyl ether tetracarboxylate, nadic anhydride and 4,4-diaminodiphenyl ether, washing with absolute ethanol and filtering.

YANG Y, WANG H, ZHANG X, LIU H

Reduced graphene oxide/nano zirconium oxide composite material filler used for synthesizing thermosetting polyimide coating, includes reduced graphene oxide material and zirconium oxide material, where chemical bond energy is comprised between zirconium oxide and reduced graphene oxide material.

WANG Q, YANG Y, LIU H, SHI G, WANG H

Flexible and highly antistatic synthetic resin comprises curing agent and modified bismaleimide.

HUANG B

Preparation of bismaleimide resin includes mixing maleic anhydride, 4,4' diaminodiphenyl sulfone, 1,4 dioxane, phase transfer catalyst and acetic anhydride, washing, drying to obtain bismaleimide resin, irradiating and evaporating solvent.

LUO Y

Preparing self-repairing flexible graphene-based electronic material useful for flexible electronics, comprises dispersing furanated graphene in anhydrous dimethylformamide, adding polydimethylsiloxane monomer and bismaleimide, and mixing.

CHEN Q, YANG X

Modified bismaleimide resin includes diallyl bisphenol A, diphenylmethane bismaleimide and graphene oxide-cage silsesquioxane obtained by mixing graphene oxide and acid-modified cage silsesquioxane.

LIU X, WANG H, YAN K, ZHENG Y

Graphene/polyimide composite material is obtained by dissolving graphene oxide in organic solution, adding polyimide monomer to graphene oxide solution, polymerizing, forming graphene oxide/polyimide composite material, and reducing.

LIU Y, MIN Y, PENG L, YANG W, XIAO Z, FENG Y

Preparing maleic anhydride-modified graphene oxide/bismaleimide nano-composite material used in e.g. automobiles, by mixing graphene oxide, maleic anhydride, 2,2'-diallyl bisphenol-A and 4,4'-diphenylmethane bismaleimide and curing.

LI W, LU S, MA K, REN R, WANG B, WANG M, YUE Y