国家/地区 中国（21） 世界知识产权组织（2）
IPC部 C（21） H（21） B（4）
IPC大类 C08（21）
IPC小类 C08K（21）
IPC C08K009/06（21）
发明人 LIU Y（4） HU B（2） HUANG Y（2）
LI Q（2） LI T（2） WANG X（2）
ZHANG Z（2） ZHONG R（2）
公开年 2021（10） 2023（5） 2018（2） 2019（2） 2022（2）
申请年 2021（5）  2022（5）  2020（4）  2019（3）  2018（2）  2023（2） 
专利权人 DONGGUAN ATP.（2）

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.

HU B, GUO H, LI B

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Microporous foam material useful in wave-absorbing material, energy storage material and sensor field, comprises thermoplastic resin, modified graphene plasticizer, lubricant and antioxidant.

HE X, LIU Y, ZHOU J, CHEN P, TAN R, JIANG T

Polypropylene composite material for use in electric automobile batteries with flame retardant and electromagnetic shielding effect, comprises polypropylene, modified expanded graphite, halogen-free flame retardant material, and modified expanded graphite contains flame retardant reinforced material.

TAN C, PENG J, HAN B, LIU S, ZHANG J

Carbon fiber reinforced graphene board, comprises curing sheet, heating film, solidifying sheet, shielding film and solidifying sheet, where curing sheet is prepared by mixing nano-cellulose, graphene and deionized water, performing ultrasonic treatment to obtain mixed solution.

JIN Y

Non-fiber reinforced fluorine-containing resin based high-frequency copper-clad plate comprises copper foils positioned on two sides of a fluorine-containing resin base plate positioned in the middle, which is prepared by using fillers such as silica, alumina, and titanate coupling agent.

XIANG Z

Silicone rubber composite material useful as electromagnetic shielding material comprises silicone rubber, silica, iron(II, III) oxide, graphene, modifiers, lubricants and crosslinking agents.

LU Y, LI Q

Low dielectric polyimide film useful in flexible printed circuit board, comprises polyimide and double-layer hollow particle, which is hollow nano-particle coated by fluorine graphene oxide.

ZHANG T, YANG F, SONG M, XIONG F, ZHANG W

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y