国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C08K（14）
IPC C08L063/00（14）
发明人 XIAO J（3） AN D（2） CHEN Y（2）
GUO H（2） LAI C（2） LIU Y（2）
WU S（2） XIA J（2）
公开年 2017（14）
申请年 2016（8）  2017（6） 
专利权人 TONGLING TON.（2） UNIV FUDAN（2）

Graphene oxide composite heat conducting sheet comprises base material, graphene oxide colloid, auxiliary agent and silicone rubber curing agent.

CAI J, CAI X, LV J

Preparing graphene-based composite thermal interface material comprises e.g. preparing modified graphene oxide, preparing graphene and composite thermal interface material of epoxy resin, and preparing composite thermal interface material.

ZHANG P, YUAN P, XIAN Y, ZENG J, XIAO J, YANG D

Epoxy resin thermal conductive composite material used in e.g. circuit board, comprises epoxy resin matrix, graphene- modified diamond particles comprising graphene grown on surface of diamond particles, and curing agent.

CHEN G, JIANG J, CHEN D

Preparation of epoxy-based composite material involves separately subjecting boron nitride/melamine composite sponge and graphene/melamine composite sponge to epoxy encapsulation perfusion, degassing, heating, curing and demolding.

WANG X, WU P

Thermally conductive polymer composite used in electronic appliances, light-emitting diode, coil ice storage air conditioners, batteries, mobile phones and computers, comprises aerogel body, which is formed from graphene and boron nitride.

AN F, HUANG C, HUANG H, LI W, LI X, QI Y, WANG L, WANG P, WU S, YU Z

Preparing graphene nano sheet reinforced carbon fiber composite material comprises dissolving thermosetting resin and curing agent in organic solvent, performing ultrasonic treatment, impregnating and curing.

WANG F

High thermal conductivity type epoxy resin composite material for LED bonding layer, contains bisphenol A type epoxy resin, boron carbide powder, aluminum oxide, glue 107, dibutyltin dilaurate, ethyl orthosilicate, graphene oxide.

LI H, LIU Y, CHEN Y

Graphene composite polysulfide sealing agent comprises two components, which are polysulphide and vulcanization paste, where polysulphide paste is liquid polysulfide rubber.

QIN P, LIU Y, WU S

High thermal conductivity composite material comprises e.g. silicon carbide, aluminum powder, silicon dioxide, aluminum nitride, polyvinyl butyral, stearic acid, silver particles, dimethyl silicone oil, graphene and lithium hydroxide.

GUO H, AN D, XIA J, XIAO J, LAI C

Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.

SUN R, LIU S, FU X