国家/地区 中国（24） 韩国（2）
IPC部 C（26） B（3）
IPC大类 C08（26）
IPC小类 C08K（26）
IPC C08L079/08（26）
发明人 LI L（3） ZHANG L（3） ZHAO X（3）
ZHOU H（3） CHEN C（2） GUO M（2）
LI Y（2） LIU T（2） WANG D（2）
YANG L（2） YANG Y（2） ZHANG W（2）
ZHAO J（2）
公开年 2023（26）
申请年 2022（14）  2023（8）  2021（4） 
专利权人 UNIV JIANGNA.（2） UNIV JILIN（2）

Producing polyimide powder used in display, automobile, medical, battery, and aerospace, involves preparing polyamic acid solution, preparing polyimide mixed solution by heating polyamic acid solution, and filtering and drying precipitate present in mixed solution to obtain polyimide powder.

LEE H S, YANG M S, LEE I S, LEE H, YANG M

Preparing polyimide-based shape-memory composite aerogel by carrying out polycondensation reaction of diamine monomer and dianhydride monomer in N-methylpyrrolidone, placing obtained polyamic acid gel in water, freeze-drying, and dispersing polyamic acid filaments and graphene oxide in water.

LI L, GUO M, LIU T

Preparing high dielectric polyimide/graphene composite film comprises performing esterification reaction hydroxylated graphene and iron-containing metal-organic framework material, adding functionalized graphene into organic solvent solution, casting, and performing thermal imidization reaction.

SHAO C, XU Z

Continuous fiber reinforced polyethylene terephthalate composite material comprises polyethylene terephthalate, carbon fiber, glass fiber, viscose fiber, phosphoserine, functional layer including e.g. nano-cellulose crystal, triallyl isocyanurate, crosslinking agent, compatibilizer, and binder.

WANG M, ZHANG L, XU M, WANG Z

Polyamideimide composite material useful for sealing valve body, comprises silicon dioxide/polyamide-imide composite material, epoxy resin, carbon fiber, acetone, dibutyl phthalate, graphene, vulcanizing agent, accelerators, and anti-aging agent.

TAO F, ZHU J

Bismaleimide resin composite material useful for carbon fiber prepreg, comprises o-diallyl bisphenol A, bismaleimide resin, accelerator, and graphene.

CHEN L, LIU H, JIAO L, LV X

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Polyimide resin useful in aerospace, electronic appliance, military equipment field, automobile, and communication, comprises carbon nanotube, nitride fine powder, modified kaolin, copper fluorosilicate, and graphene and polyimide resin.

ZHOU Z, WU B, ZHOU H

Shape memory polyimide aerogel used in heat insulation, comprises polyimide precursor which is prepared by polycondensation reaction using diamine and dianhydride monomers, followed by sol-gelation, freeze-drying and thermal-imidization.

ZHANG W, LI J, ZHANG L

High-smooth and heat-insulating polyimide film useful for motors, comprises e.g. polyamic acid, distilled water, N-methylpyrrolidone, calcium stearate, polyamide resin, polyethylene wax, polyethylene, polyisobutylene, graphene powder, silicon dioxide powder, and calcium carbonate powder.

TIAN B, ZOU W, JIN Y, DING Y