国家/地区 日本（12）
IPC部 C（12）
IPC大类 C08（12）
IPC小类 C08G（12）
IPC C08K003/04（12）
发明人 JIN R（2） KIM Y S（2）
公开年 2022（4） 2021（3） 2012（2）
申请年 2021（4）  2012（2）  2020（2） 
专利权人 SAMSUNG ELEC.（2） TICONA LLC（2）

Conductive polymer composition used for forming film, comprises polythiophene containing at least two structural units and carbon material.

KUDO K, KAWAKAMI J, SENNO Y

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-electrode composition used in contact with skin of living body for detecting physical conditions such as heart rate, comprises (A) reaction composite comprising ionic polymer material and carbon particle.

HATAKEYAMA J, SHANRUN

Conductive powder used for forming coating material for forming electrode, comprises conductive polymer powder containing (pi)-conjugated conductive polymer and polyanion, and graphene.

MATSUBAYASHI S, TAKEZAWA Y

New ionic organic compound for nano carbon-material dispersion liquid, composite solid and for manufacturing the nanocarbon-material film.

MATSUSAWA Y, KOTOKU H

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Manufacture of polyaniline-reduced graphene oxide composite used as e.g. ink for electromagnetic application, involves mixing graphene oxide dispersion containing emulsifying agent and oligomer solution and oxidizing.

BOCCHINI S, CHIOLERIO A, PORRO S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S