国家/地区 中国（9） 美国（2）
IPC部 C（12） B（2）
IPC大类 C08（12）
IPC小类 C08G（12）
IPC C08K003/38（12）
发明人 LI X（2） LIU J（2） ZHU Y（2）
公开年 2022（12）
申请年 2022（11） 
专利权人

Preparing boron-doped fluorinated polyimide film used in supercapacitor, involves obtaining polyimide by weighing certain amount of diamine, and four organic solvent and adding into mouth flask, stirring at normal temperature to diamine to dissolve, and weighing certain mass of dianhydride.

LI X

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C

Peeling graphene useful in preparing graphene flexible film, comprises mixing graphite powder, bio-based graphene dispersant and deionized water evenly, and peeling off mechanically to obtain graphene dispersion.

LIU J, YANG J, WU Q, WU M, ZHU Y, ZHANG J

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Low-dielectric heat-conducting polyimide film comprises raw materials comprising dianhydride monomer, diamine monomer, solvent B, heat conducting filler, coupling agent, auxiliary agent and solvent A.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X

Preparing high thermal conductivity polyimide film by mixing alkynylated graphene and N,N-dimethylformamide, ultrasonically dispersing, ultrasonically dispersing magnetic boron azide and N,N-dimethylformamide, adding sodium ascorbate and triethylamine, and adding copper sulfate pentahydrate.

XU Z, XU J

Phase-change hydrated salt polymerization filling material, comprises polyether polyol, foaming agent, flame retardant and heat conducting material, polymeric MDI and adhesive, polyether polyol, silicone oil and composite phase-change nano material.

ZHU Y, SHI C, LI J, LIU J, LIN Y, ZHANG P, XIN H

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H