国家/地区 中国（28） 美国（8） 世界知识产权组织（7） 台湾（6） 韩国（3） 欧洲专利局（EPO）（2）
IPC部 C（36）
IPC大类 C08（36）
IPC小类 C08G（36）
IPC C08K003/22（36）
发明人 FUJIMOTO T（4） MANDAL S（3） CAI J（2）
DENG H（2） FENG L（2） HUANG B（2）
KONWAR D B（2） LI G（2） LIN W（2）
LIU Z（2） MILLER C（2） QIU S（2）
RAJENDRA V（2） WU Y（2） XU Z（2）
公开年 2022（36）
申请年 2022（19）  2021（10）  2020（7） 
专利权人 MOMENTIVE PE.（4） GUANGDONG JO.（2）

Preparing smoke suppressant comprises adding carbon material into organic solvent, adding copper nitrate and cobalt nitrate, reacting organic ligand with metal ion, and winding metal organic framework of double metal on carbon material.

SU X, TIAN X, XU X, DAI S, BO G, YAN Y

Preparing degradable polybutylene adipate terephthalate useful in preparing film products, comprises esterifying terephthalic acid, butanediol, catalyst and stabilizer with zinc oxide-graphene and esterifying adipic acid, butanediol, catalyst, and stabilizer and esterifying obtained prepolymers.

LIU W, RAO J

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Flame-retardant release film comprises polyester base film and silicone release coating, where polyester-based base film is obtained by modifying polyester drawing film with titanate coupling agent modified polyester.

HU G, LIN M, FENG L

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Preparing high heat resistant high thermal conductivity copper clad laminate by mixing e.g. paper base fiber, adding silica sol, adding slurry into mold for hot pressing, impregnating high thermal conductivity reinforcing material with epoxy resin glue, laminating prepreg and cladding copper foil.

ZHOU P

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Anti-deformation composite anti-fatigue pad useful as indoor sports pad and kitchen floor mat, comprises e.g. foaming material including polyether polyol, polyester polyol, polymethylene polyphenyl polyisocyanate, non-ionic polyisocyanate, diphenylmethane diisocyanate and cellulose nanocrystals.

SHAO J, SONG J

Automatic temperature-limiting heating cloth comprises temperature-limited heating wire, electrode connecting belts, and laminating film layer, where electrode connecting belt are connected with positive and negative electrodes of power supply.

PENG Y, SHAO M

One-component thermal-gel composition used for heat dissipating material for dissipating heat from substrate, comprises crosslinkable organopolysiloxane, hydrolyzable organopolysiloxane, thermal conductivity enhancing agent, organopolysiloxane, adhesion promoter, antioxidant, and pigment.

DUTTA P, DASGUPTA D, MS A, FUJIMOTO T, CHISATO H, ANJITHA M, HOSHINO C