国家/地区 中国（11）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08G（11）
IPC C08K003/22（11）
发明人
公开年 2015（3） 2019（2） 2021（2） 2022（2）
申请年 2015（3）  2019（3）  2020（2） 
专利权人

Automatic temperature-limiting heating cloth comprises temperature-limited heating wire, electrode connecting belts, and laminating film layer, where electrode connecting belt are connected with positive and negative electrodes of power supply.

PENG Y, SHAO M

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Preparing electromagnetic wave shielding thermoplastic polyurethane involves putting polytetramethylene ether glycol, butanediol, isocyanate, antioxidant, yellowing-resistant agent and catalyst into reaction vessel under heating.

HE P

Ionic polymer used in polymer composition for forming electrolyte for electrode of electrochemical cell, comprises repeating unit which is obtained by reacting functional groups-containing compound and metal bis(halosulfonyl)imide compound.

DAIGLE J, LAROUCHE A, CHAREST P, GUERFI A, DONTIGNY M, ARMAND M, HINTENNACH A, ZAGHIB K, CHARREST P, DONITY M

Graphene-iron iron oxide-polyaniline ternary nano composite material with adjustable wave absorption properties comprises reduced graphene oxide, polyaniline, and rest is ferric oxide.

JIN Y, LUO X, ZHANG J, YU Y, WU B, LU F, QI Y

Ferrite-graphene-modified polycarboxypyrrole wave absorbing material comprises ferric chloride hexahydrate, anhydrous aluminum sulfate, cobalt chloride hexahydrate, oxalic acid, pyrrole, synergistic catalyst and graphene.

MA H, GUO C, TANG K

Photosensitive polyimide resin composition comprises photosensitive polyimide derivative, photoinitiator, free radical polymeric compound, solvent, alumina, graphene, inorganic clay, silicon oxide and zinc oxide.

HUANG T, ZHUANG C, SHI Y, XIE K, HUANG T C, CHUANG C C, SHIH Y C, HSIEH K H

Modified epoxy resin adhesive used in LED chip packaging comprises bisphenol A epoxy resin, m-phenylenediamine, oxidized graphene, nano zirconium oxide, carbon nanotube, silane coupling agent and aluminum isopropoxide.

QIN T

High-dielectric polyimide composite film for load capacitor, contains vanadium pentoxide, expanded graphite, pyromellitic dianhydride, graphene, ethanol, hydroxyethyl methacrylate, polyvinyl alcohol, water and boric acid solution.

TANG B, TANG F

High-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material useful for light-emitting diode packaging, comprises e.g. phenyltrimethoxysilane, divinyltetramethyldisiloxane, silica and graphene.

ZHU Z